公开(公告)号：US20170323849A1

公开(公告)日：2017-11-09

申请号：US15528049

申请日：2015-11-10

Applicant: TSINGHUA UNIVERSITY

Inventor： Qian WANG ,  Tiwei WEI ,  Jian CAI ,  Ziyu LIU

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/15 ,  H05K1/14 ,  H05K3/36

CPC classification number: H01L23/49827 ,  H01L21/48 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/141 ,  H05K1/144 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/00

Abstract: Disclosed is an adapter panel and a method of manufacturing the same comprising a panel body having a first surface and an opposing second surface, wherein a through-hole in a frustrum shape is formed through the panel body and filled by a conical electrical conductor between the first and second surface. The conical electrical conductor has a plane end flush with the first surface and a tip end protruding from the second surface. The panel body further comprises a wiring structure on the first surface electrically connected to the plane end of the conical electrical conductor. Bonding to a dielectric plate can be achieved by directly inserting the tip end of the conical electrical conductor into a solder ball.

公开(公告)号：US20160172326A1

公开(公告)日：2016-06-16

申请号：US14392281

申请日：2014-01-26

Applicant: TSINGHUA UNIVERSITY

Inventor： Jian CAI ,  Ziyu LIU ,  Qian WANG ,  Shuidi WANG ,  Yang HU ,  Yu CHEN

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/13011 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/14051 ,  H01L2224/1705 ,  H01L2224/17107 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81201 ,  H01L2224/8122 ,  H01L2224/81345 ,  H01L2224/81355 ,  H01L2224/81359 ,  H01L2224/8182 ,  H01L2224/81897 ,  H01L2224/81898 ,  H01L2224/81906 ,  H01L2224/94 ,  H01L2224/81

Abstract: In view of the problems in all existing bonding methods, such as high temperature, high pressure, and high surface modification cost, etc., the present invention provides a bonding method and a bonding structure formed using the same, which can overcome such drawbacks and also achieve wafer-level bonding under a condition of normal temperature and low pressure. The bonding method comprises: generating bonding structures capable of being mutually mechanical interlocked, wherein, the frictional heat generated by the bonding structures capable of being mutually mechanical interlocked is higher than the bonding energy therebetween; and, utilizing the frictional heat generated by the bonding structures capable of being mutually mechanical interlocked to bond the bonding structures capable of being mutually mechanical interlocked.

Abstract translation: 鉴于所有现有的接合方法（如高温，高压，高表面改性成本等）的问题，本发明提供了一种能够克服这些缺陷的接合方法和使用其的接合结构， 也可以在正常温度和低压条件下实现晶圆级接合。 接合方法包括：产生能够相互机械互锁的接合结构，其中由能够互相机械互锁的接合结构产生的摩擦热高于其间的接合能; 并且利用由能够相互机械互锁的接合结构产生的摩擦热来结合能够相互机械互锁的接合结构。

公开(公告)号：US20170005022A1

公开(公告)日：2017-01-05

申请号：US15113639

申请日：2014-01-27

Applicant: TSINGHUA UNIVERSITY

Inventor： Qian WANG ,  Lin TAN ,  Jian CAI ,  Yu CHEN

IPC: H01L23/31 ,  H01L21/02 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29

CPC classification number: H01L23/3128 ,  H01L21/0206 ,  H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L23/293 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/06135 ,  H01L2224/32225 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Disclosed are a packaging structure, a packaging method and a template used in packaging method. The packaging structure comprises: a substrate; a chip mounted on the substrate; bonding wires for electrically connecting the substrate to the chip; and a protective layer which is formed on the substrate and is used for covering the chip, the bonding wires and bonding pads connected to the bonding wires, the size of the protective layer being smaller than that of the substrate. The packaging structure, the packaging method and the template used in packaging method can solve the problems in the prior art of the great difficulty in designing a mold chase, a complicated molding process, a high manufacturing cost and a high molding material consumption.

Abstract translation: 公开了包装方法中使用的包装结构，包装方法和模板。 包装结构包括：基材; 安装在基板上的芯片; 用于将基板电连接到芯片的接合线; 以及保护层，其形成在基板上，用于覆盖芯片，连接到接合线的接合线和接合焊盘，保护层的尺寸小于基板的尺寸。 包装结构，包装方法和包装方法中使用的模板可以解决现有技术中难以设计模具追求，复杂成型工艺，高制造成本和高成型材料消耗的问题。