公开(公告)号：US20110304993A1

公开(公告)日：2011-12-15

申请号：US13156496

申请日：2011-06-09

Applicant: Tadaji TAKEMURA

Inventor： Tadaji TAKEMURA

IPC: H05K1/02

CPC classification number: H01L23/3121 ,  H01L23/49811 ,  H01L23/552 ,  H01L25/0655 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0216 ,  H05K3/284 ,  H05K9/0039 ,  H05K2201/09972 ,  H05K2201/10371

Abstract: In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.

Abstract translation: 在电路模块中，导电隔板由设置在部件安装表面上的多个导电芯片限定。 部件安装表面由导电隔板分成第一块和第二块。 通过改变导电芯片的位置和导电芯片的数量，可以根据电路板的尺寸和第一块和第二块中的电子部件的布置自由地改变导电隔板的形状。 通过导电隔板防止第一块和第二块之间的电磁干扰。