公开(公告)号：US06294742B1

公开(公告)日：2001-09-25

申请号：US09363497

申请日：1999-07-27

Applicant: Ted B Ziemkowski

Inventor： Ted B Ziemkowski

IPC: H05K100

CPC classification number: H05K1/0209 ,  H05K1/111 ,  H05K2201/0373 ,  H05K2201/09781 ,  H05K2201/10166 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. Included is a printed wiring board having solder pads disposed on its surface that are adapted for soldering to leads of surface mount components. The solder pads are electrically interconnected by conductive traces also disposed on the surface. At least one of the solder pads has an enhanced surface area that is selected larger than necessary for the soldering, and that is selected sufficiently large so as to sink enough heat generated by one of the surface mount components to provide for its proper operation.

Abstract translation: 表面贴装焊盘，其适于作为焊接到焊盘的电子部件的散热器。 包括印刷线路板，其上表面上设置有适于焊接到表面安装部件的引线的焊盘。 焊盘通过也布置在表面上的导电迹线电互连。 焊盘中的至少一个具有被选择为大于焊接所需的更大的表面积，并且被选择得足够大以便吸收由一个表面安装部件产生的足够的热量以提供其正确的操作。

公开(公告)号：US06651323B2

公开(公告)日：2003-11-25

申请号：US09851064

申请日：2001-05-07

Applicant: Ted B Ziemkowski

Inventor： Ted B Ziemkowski

IPC: H01R900

CPC classification number: H05K1/0209 ,  H05K1/111 ,  H05K2201/0373 ,  H05K2201/09781 ,  H05K2201/10166 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method for manufacturing a surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. The method comprises a step of providing a printed wiring board having a conductive layer disposed thereon. The method further comprises a step of selecting a size and arrangement of regions of a solder pad so as to sink sufficient heat. The method also comprises removing non-selected regions of the conductive layer to produce solder pads on the surface of the printed wiring board enhanced with features that promote heat transfer to sink enough heat generated by one of the surface mount components to provide for its proper operation.

Abstract translation: 一种用于制造表面贴装焊盘的方法，其适于用作焊接到焊盘的电子部件的散热器。 该方法包括提供其上布置有导电层的印刷线路板的步骤。 该方法还包括选择焊盘的区域的尺寸和布置以便吸收足够的热量的步骤。 该方法还包括去除导电层的未选择的区域，以在印刷线路板的表面上产生焊盘，其特征在于促进热传递以吸收由一个表面安装部件产生的足够的热量以提供其适当的操作 。

公开(公告)号：US06479962B2

公开(公告)日：2002-11-12

申请号：US09811174

申请日：2001-03-16

Applicant: Ted B Ziemkowski ,  Heather N Bean ,  Mark J Bianchi

Inventor： Ted B Ziemkowski ,  Heather N Bean ,  Mark J Bianchi

IPC: H02V700

CPC classification number: H02J7/0003 ,  H02J7/0031

Abstract: A battery management system and method for an electronic device that may be powered by an AC source (using an AC adapter), or by a battery. The battery management system includes firmware configured to determine whether a battery coupled to the electronic device is rechargeable. The firmware is also coupled to and configured to control a charge switch. When the battery and an AC source are both coupled to the device, activating the charge switch causes a charging current to be applied from the AC source to the battery. The charge switch and firmware are configured to cause the charging current to not be applied to the battery if it is determined that the battery is not rechargeable.

Abstract translation: 可以由AC电源（使用AC适配器）或电池供电的电子设备的电池管理系统和方法。 电池管理系统包括被配置为确定耦合到电子设备的电池是否可再充电的固件。 固件还耦合到并配置成控制充电开关。 当电池和AC电源都耦合到设备时，启动充电开关导致从AC电源向电池施加充电电流。 如果确定电池不可再充电，则充电开关和固件被配置为使得充电电流不被施加到电池。