公开(公告)号：US20190109104A1

公开(公告)日：2019-04-11

申请号：US16107545

申请日：2018-08-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： NAZILLA DADVAND ,  HELMUT RINCK

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/78

Abstract: A system and method for bonding an electrically conductive mechanical interconnector (e.g., a bonding wire, solder, etc.) to an electrical contact (e.g., contact pad, termination on a printed circuit board (PCB), etc.) made from an electrically conductive metal (e.g., aluminum) on an electronic device (e.g., integrated circuit (IC), die, wafer, PCB, etc.) is provided. The electrical contact is chemically coated with a metal (e.g., cobalt) that provides a protective barrier between the mechanical interconnector and the electrical contact. The protective barrier provides a diffusion barrier to inhibit galvanic corrosion (i.e. ion diffusion) between the mechanical interconnector and the electrical contact.

公开(公告)号：US20180218993A1

公开(公告)日：2018-08-02

申请号：US15936748

申请日：2018-03-27

Applicant: Texas Instruments Incorporated

Inventor： HELMUT RINCK ,  GERNOT BAUER ,  ROBERT ZRILE ,  KAI-ALEXANDER SCHACHTSCHNEIDER ,  MICHAEL OTTE ,  HARALD WIESNER

IPC: H01L23/00 ,  H01L23/532 ,  H01L23/522

CPC classification number: H01L24/13 ,  H01L23/5226 ,  H01L23/53204 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/94 ,  H01L2224/0345 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03622 ,  H01L2224/03828 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05157 ,  H01L2224/05558 ,  H01L2224/05657 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/94 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/2064 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2924/01078 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/01051

Abstract: A method of forming bond pads includes providing a substrate including an integrated circuit (IC) device formed thereon having an oxidizable uppermost metal interconnect layer which provides a plurality of bond pads that are coupled to circuit nodes on the IC device. The plurality of bond pads includes a metal bond pad area. A cobalt including connection layer is deposited directly on the metal bond pad area. The cobalt including connection layer is patterned to provide a cobalt bond pad surface for the plurality of bond pads, and a solder material is formed on the cobalt bond pad surface.

公开(公告)号：US20140239500A1

公开(公告)日：2014-08-28

申请号：US13775484

申请日：2013-02-25

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： HELMUT RINCK ,  FROMUND METZ ,  JAN HERMANN PAPE ,  JANET RILEY

IPC: H01L23/00 ,  H01L21/768

CPC classification number: H01L21/768 ,  H01L23/3171 ,  H01L23/34 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/552 ,  H01L24/05 ,  H01L2224/05554 ,  H01L2924/1461 ,  H01L2924/00

Abstract: An integrated circuit (IC) die has a top side surface providing circuitry including active circuitry configured to provide a function, including at least one bond pad formed from a bond pad metal coupled to a node in the circuitry. A dielectric passivation layer is over a top side surface of a substrate providing a contact area which exposes the bond pad. A metal capping layer includes an electrically conductive metal or an electrically conductive metal compound over at least the contact area to provide corrosion protection to the bond pad metal, which is in electrical contact with the bond pad metal. The metal capping layer can extend over structures other than the bond pads, such as to cover at least 80% of the area of the IC die to provide structures on the IC die protection from incident radiation.

Abstract translation: 集成电路（IC）管芯具有顶侧表面提供电路，其包括被配置为提供功能的有源电路，所述功能包括由耦合到所述电路中的节点的接合焊盘金属片形成的至少一个接合焊盘。 电介质钝化层位于衬底的顶侧表面上，提供暴露接合焊盘的接触区域。 金属覆盖层包括在至少接触区域上的导电金属或导电金属化合物，以向与接合焊盘金属电接触的接合焊盘金属提供腐蚀保护。 金属覆盖层可以在结合焊盘之外的结构上延伸，例如覆盖IC芯片的至少80％的面积，以提供IC芯片上的结构，防止入射辐射。