公开(公告)号：US10405746B2

公开(公告)日：2019-09-10

申请号：US14686275

申请日：2015-04-14

Applicant: The University of Memphis Research Foundation

Inventor： Bashir I. Morshed ,  Sergi Consul-Pacareu

IPC: H04Q9/00 ,  G08C17/02 ,  H04Q9/14 ,  A61B5/00 ,  A61B5/01 ,  A61B5/0402 ,  A61B5/0476 ,  A61B5/053 ,  A61B5/1455

Abstract: In one embodiment, a method is disclosed in which an analog sensor receives an electromagnetic (EM) wave (e.g., a radio frequency signal) from an interrogation device. The sensor converts a biological measurement of a subject into an electrical resistance and modulates a response to reflect the incident signal based on the electrical resistance. The sensor then provides the response to the interrogation device that corresponds to the biological measurement.

公开(公告)号：US20170135215A1

公开(公告)日：2017-05-11

申请号：US15346847

申请日：2016-11-09

Applicant: The University of Memphis Research Foundation

Inventor： Bashir I. Morshed

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03 ,  H05K3/12 ,  H05K1/09 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/181 ,  H05K1/028 ,  H05K1/0353 ,  H05K1/0393 ,  H05K1/097 ,  H05K1/113 ,  H05K1/118 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/125 ,  H05K3/303 ,  H05K3/4007 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0759 ,  H05K2203/1131

Abstract: A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.

公开(公告)号：US10182499B2

公开(公告)日：2019-01-15

申请号：US15346847

申请日：2016-11-09

Applicant: The University of Memphis Research Foundation

Inventor： Bashir I. Morshed

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03 ,  H05K3/12 ,  H05K1/09 ,  H05K1/02 ,  H05K3/30

Abstract: A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.