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1.
公开(公告)号:US11114321B2
公开(公告)日:2021-09-07
申请号:US16104335
申请日:2018-08-17
Applicant: Tokyo Electron Limited
Inventor: Sylvain Ballandras , Thierry Laroche , Kimihiro Matsuse , Jacques Berg , Tomohide Minami
IPC: G01K11/22 , H01L21/67 , G01K13/00 , G01K3/14 , H03H9/02 , H03H9/25 , H03H1/00 , H01J37/32 , H03H3/08 , H03H9/42 , G01D5/48 , G01K1/02 , G01K11/26
Abstract: An apparatus and method for real-time sensing of properties in industrial manufacturing equipment are described. The sensing system includes first plural sensors mounted within a processing environment of a semiconductor device manufacturing system, wherein each sensor is assigned to a different region to monitor a physical or chemical property of the assigned region of the manufacturing system, and a reader system having componentry configured to simultaneously and wirelessly interrogate the plural sensors. The reader system uses a single high frequency interrogation sequence that includes (1) transmitting a first request pulse signal to the first plural sensors, the first request pulse signal being associated with a first frequency band, and (2) receiving uniquely identifiable response signals from the first plural sensors that provide real-time monitoring of variations in the physical or chemical property at each assigned region of the system.
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2.
公开(公告)号:US20210343560A1
公开(公告)日:2021-11-04
申请号:US17378190
申请日:2021-07-16
Applicant: Tokyo Electron Limited
Inventor: Sylvain Ballandras , Thierry Laroche , Kimihiro Matsuse , Jacques Berg , Tomohide Minami
IPC: H01L21/67 , G01K11/22 , G01K13/00 , G01K3/14 , H03H9/02 , H03H9/25 , H03H1/00 , H01J37/32 , H03H3/08 , H03H9/42 , G01D5/48 , G01K1/02 , G01K11/26
Abstract: An apparatus and method for real-time sensing of properties in industrial manufacturing equipment are described. The sensing system includes first plural sensors mounted within a processing environment of a semiconductor device manufacturing system, wherein each sensor is assigned to a different region to monitor a physical or chemical property of the assigned region of the manufacturing system, and a reader system having componentry configured to simultaneously and wirelessly interrogate the plural sensors. The reader system uses a single high frequency interrogation sequence that includes (1) transmitting a first request pulse signal to the first plural sensors, the first request pulse signal being associated with a first frequency band, and (2) receiving uniquely identifiable response signals from the first plural sensors that provide real-time monitoring of variations in the physical or chemical property at each assigned region of the system.
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3.
公开(公告)号:US20190057887A1
公开(公告)日:2019-02-21
申请号:US16104335
申请日:2018-08-17
Applicant: Tokyo Electron Limited
Inventor: Sylvain Ballandras , Thierry Laroche , Kimihiro Matsuse , Jacques Berg , Tomohide Minami
IPC: H01L21/67 , G01K11/22 , G01K13/00 , G01K3/14 , H03H9/02 , H03H9/42 , H03H9/25 , H03H1/00 , H01J37/32 , H03H3/08
Abstract: An apparatus and method for real-time sensing of properties in industrial manufacturing equipment are described. The sensing system includes first plural sensors mounted within a processing environment of a semiconductor device manufacturing system, wherein each sensor is assigned to a different region to monitor a physical or chemical property of the assigned region of the manufacturing system, and a reader system having componentry configured to simultaneously and wirelessly interrogate the plural sensors. The reader system uses a single high frequency interrogation sequence that includes (1) transmitting a first request pulse signal to the first plural sensors, the first request pulse signal being associated with a first frequency band, and (2) receiving uniquely identifiable response signals from the first plural sensors that provide real-time monitoring of variations in the physical or chemical property at each assigned region of the system.
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