Abstract:
A vibration circuit includes: a micro electro mechanical systems (MEMS) vibrator which includes a first electrode and a second electrode which are arranged with a gap therebetween; an amplification section which includes a gain section which has a first input terminal and a first output terminal and of which gain is greater than 1, and a gain restriction section which includes a second input terminal and a second output terminal and of which the gain is less than 1; and an output terminal which is connected to the first output terminal, wherein the first electrode is connected to the first input terminal, wherein the first output terminal is connected to the second input terminal, and wherein the second output terminal is connected to the second electrode.
Abstract:
A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the fixed electrode. The well is one of an n-type well and a p-type well. The p-type well applies a positive voltage to the fixed electrode while the n-type well applies a negative voltage to the fixed electrode.
Abstract:
A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the fixed electrode. The well is one of an n-type well and a p-type well. The p-type well applies a positive voltage to the fixed electrode while the n-type well applies a negative voltage to the fixed electrode.
Abstract:
A method is for manufacturing a microeletromechanical system resonator having a semiconductor device and a microelectromechanical system structure unit formed on a substrate. The method includes: forming a lower electrode of an oxide-nitride-oxide capacitor unit included in the semiconductor device using a first silicon layer; forming, using a second silicon layer, a substructure of the microelectromechanical system structure unit and an upper electrode of the oxide-nitride-oxide capacitor unit included in the semiconductor device; and forming, using a third silicon layer, a superstructure of the microelectromechanical system structure unit and a gate electrode of a complementary metal oxide semiconductor circuit unit included in the semiconductor device.
Abstract:
A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the fixed electrode. The well is one of an n-type well and a p-type well. The p-type well applies a positive voltage to the fixed electrode while the n-type well applies a negative voltage to the fixed electrode.
Abstract:
An optical assembly (OSA) that installs a semiconductor optical device mounted on a thermo-electric controller (TEC) is disclosed. The TEC in the upper plate thereof is mechanically connected to the housing, or to the block stiffly fixed to the housing by a bridge made of stiff material. The bridge preferably extends along the optical axis to show enhanced durability against the impact caused by an external ferrule abutting against the receptacle of the OSA.
Abstract:
According to one embodiment, a magnetic head slider includes: a magnetic head; a slider main body configured to be provided with the magnetic head; a first protrusion portion configured to be provided on the slider main body so as to abut the magnetic head; a second protrusion portion configured to be provided on a top surface of the first protrusion portion; and a cutout portion configured to be provided to an edge portion on the top surface of the second protrusion portion, the edge portion being on a side of the top surface.
Abstract:
An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the cover structure includes a laminated structure of an interlayer insulating film and a wiring layer, the laminated structure being formed on the substrate in such a way that it surrounds the cavity portion, and the cover structure has an upside cover portion covering the cavity portion from above, the upside cover portion being formed with part of the wiring layer that is disposed above the functional structure.
Abstract:
An oscillator includes: a plurality of MEMS vibrators formed on a substrate; and an oscillator configuration circuit connected to the plurality of MEMS vibrators, wherein the plurality of MEMS vibrators each have a beam structure, and the respective beam structures are different, whereby their resonant frequencies are different.
Abstract:
An oscillator includes: a vibrator having a first electrode and a second electrode disposed with a gap with the first electrode; a reference voltage supply circuit adapted to supply a reference voltage; and a voltage adjustment circuit having a step-up circuit operating in response to input of clock pulses and adapted to convert the reference voltage into a voltage of a predetermined level and to output the voltage of the predetermined level, wherein the vibrator is configured so as to apply the voltage of the predetermined level, which is output from the voltage adjustment circuit, between the first electrode and the second electrode, and the clock pulses to be input into the step-up circuit are obtained using the vibrator as a source.