公开(公告)号：US09585240B2

公开(公告)日：2017-02-28

申请号：US14062494

申请日：2013-10-24

Applicant: TriQuint Semiconductor, Inc.

Inventor： Thomas R. Landon, Jr. ,  Paul D. Bantz ,  Tarak A. Railkar

IPC: H05K1/16 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0204 ,  H05K1/0207 ,  H05K1/0215 ,  H05K1/0216 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/10416 ,  H05K2203/0191 ,  Y10T29/49155

Abstract: A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied to the laminate substrate which is directly coupled with the slug and the routing layer. In embodiments, a dielectric layer may be coupled with the capping layer, and an additional routing layer may be coupled with the dielectric layer. Therefore, the routing layer may be an “inner” routing layer that is coplanar with, and coupled with, the slug.

Abstract translation: 层压基板可以包括位于层叠芯的空腔内的块状物。 层压基板可以在层叠芯的任一侧上具有路由层，其中至少一个与块的外侧共面。 然后可以将覆盖层施加到与块和路由层直接耦合的层压基板。 在实施例中，电介质层可以与覆盖层耦合，并且附加布线层可以与电介质层耦合。 因此，路由层可以是与块状体共面并与其结合的“内部”路由层。

公开(公告)号：US20150116947A1

公开(公告)日：2015-04-30

申请号：US14062494

申请日：2013-10-24

Applicant: TriQuint Semiconductor, Inc.

Inventor： Thomas R. Landon, Jr. ,  Paul D. Bantz ,  Tarak A. Railkar

IPC: H05K1/02 ,  H05K3/44

CPC classification number: H05K1/0204 ,  H05K1/0207 ,  H05K1/0215 ,  H05K1/0216 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/10416 ,  H05K2203/0191 ,  Y10T29/49155

Abstract: A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied to the laminate substrate which is directly coupled with the slug and the routing layer. In embodiments, a dielectric layer may be coupled with the capping layer, and an additional routing layer may be coupled with the dielectric layer. Therefore, the routing layer may be an “inner” routing layer that is coplanar with, and coupled with, the slug.

Abstract translation: 层压基板可以包括位于层叠芯的空腔内的块状物。 层压基板可以在层叠芯的任一侧上具有路由层，其中至少一个与块的外侧共面。 然后可以将覆盖层施加到与块和路由层直接耦合的层压基板。 在实施例中，电介质层可以与覆盖层耦合，并且附加布线层可以与电介质层耦合。 因此，路由层可以是与块状体共面并与其结合的“内部”路由层。