公开(公告)号：US20120235261A1

公开(公告)日：2012-09-20

申请号：US13412951

申请日：2012-03-06

Applicant: Tsuyoshi YODA ,  Nobuaki HASHIMOTO

Inventor： Tsuyoshi YODA ,  Nobuaki HASHIMOTO

IPC: H01L31/02 ,  H01L21/768 ,  H01L23/48

CPC classification number: H01L23/3114 ,  H01L21/76898 ,  H01L27/14636 ,  H01L27/14649 ,  H01L27/14692 ,  H01L31/022408 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A via hole is formed on a base substrate before a device circuit is formed, and thermal oxidation is performed to form a thermal oxidation layer on a surface of the base substrate on which the device circuit is formed and a surface in the via hole. The device circuit having a conductive section is formed on the base substrate after the thermal oxidation, and then, a conductive body is embedded in the via hole.

Abstract translation: 在形成器件电路之前，在基底基板上形成通孔，并且在形成有器件电路的基底基板的表面和通孔的表面上进行热氧化以形成热氧化层。 具有导电部分的器件电路在热氧化之后形成在基底基板上，然后将导电体嵌入通孔中。

公开(公告)号：US20110271757A1

公开(公告)日：2011-11-10

申请号：US13083806

申请日：2011-04-11

Applicant: Tsuyoshi YODA

Inventor： Tsuyoshi YODA

IPC: H05K1/11 ,  H05K3/32 ,  G01P15/14

CPC classification number: H01L21/76898 ,  B81B7/0006 ,  B81B2201/0242 ,  B81B2201/0271 ,  G01C19/56 ,  G01C19/5776 ,  H01L21/76877 ,  H01L23/481 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K3/225 ,  H05K3/321 ,  H05K3/4038 ,  H05K3/429 ,  H05K3/462 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49139

Abstract: A wiring substrate includes: a substrate having a first surface and a second surface; a first insulating layer stacked on the first surface; a pad electrode stacked on the first insulating layer; a through electrode connected to the pad electrode; and a second insulating layer disposed between the substrate and the through electrode and between the first insulating layer and the through electrode, wherein a diameter of the through electrode in a connection section between the pad electrode and the through electrode is smaller than a diameter of the through electrode on the second surface side, the first insulating layer, the second insulating layer and the through electrode overlap with each other in a peripheral area of the connection section, when seen from a plan view, and the thickness of the first insulating layer in the area is thinner than the thickness of the first insulating layer in other areas.

Abstract translation: 布线基板包括：具有第一表面和第二表面的基板; 堆叠在第一表面上的第一绝缘层; 堆叠在所述第一绝缘层上的焊盘电极; 连接到焊盘电极的贯通电极; 以及设置在所述基板和所述贯通电极之间并且位于所述第一绝缘层与所述贯通电极之间的第二绝缘层，其中，所述焊盘电极和贯通电极之间的连接部中的贯通电极的直径小于 在第二表面侧的贯通电极，第一绝缘层，第二绝缘层和贯通电极在连接部的周边区域彼此重叠，从平面图看，第一绝缘层的厚度 该区域比其它区域的第一绝缘层的厚度薄。

公开(公告)号：US20100123256A1

公开(公告)日：2010-05-20

申请号：US12619753

申请日：2009-11-17

Applicant: Tsuyoshi YODA ,  Kazumi HARA

Inventor： Tsuyoshi YODA ,  Kazumi HARA

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L24/13 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor substrate and a through electrode provided in a through hole formed in the semiconductor substrate. The through electrode partially protrudes from a back surface of the semiconductor substrate, which is opposite to an active surface thereof. The through electrode includes a resin core and a conductive film covering at least a part of the resin core.

Abstract translation: 半导体器件包括半导体衬底和设置在形成于半导体衬底中的通孔中的通孔。 贯通电极从半导体基板的与其有效面相反的背面部分突出。 贯通电极包括树脂芯和覆盖至少一部分树脂芯的导电膜。

公开(公告)号：US20100291715A1

公开(公告)日：2010-11-18

申请号：US12844373

申请日：2010-07-27

Applicant: Tsuyoshi YODA

Inventor： Tsuyoshi YODA

IPC: H01L21/30

CPC classification number: B41J2/14233 ,  B41J2002/14419 ,  B41J2002/14491 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K3/185 ,  H05K3/32 ,  H05K3/403 ,  Y10T29/49126 ,  Y10T29/49401 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A liquid droplet ejection head includes: a first substrate having a pressurizing chamber with a nozzle aperture that ejects liquid droplets, and a first surface on which is formed a first wiring electrically connected to the drive element; a second substrate disposed on the first surface of the first substrate and covering the driven element, the second substrate having a second surface and a side surface, the second surface facing in a same direction as the first surface of the first substrate and on which is formed a second wiring, the side surface on which is formed a third wiring that combines the first wiring and the second wiring; a semiconductor element disposed on the second surface of the second substrate, and which drives the driven element; and plating that electrically connects the first wiring, the second wiring, the third wiring, and a connection terminal of the semiconductor element.

Abstract translation: 液滴喷射头包括：第一基板，具有具有喷射孔的喷射孔的加压室，第一表面形成有与驱动元件电连接的第一布线; 第二基板，设置在第一基板的第一表面上并覆盖从动元件，第二基板具有第二表面和侧表面，第二表面面向与第一基板的第一表面相同的方向， 形成第二布线，其侧面形成有组合第一布线和第二布线的第三布线; 半导体元件，设置在所述第二基板的第二表面上，并且驱动所述从动元件; 以及电连接半导体元件的第一布线，第二布线，第三布线和连接端子的电镀。