公开(公告)号：US20050205992A1

公开(公告)日：2005-09-22

申请号：US11074351

申请日：2005-03-07

Applicant: Tsuyoshi Yoda ,  Suguru Akagawa

Inventor： Tsuyoshi Yoda ,  Suguru Akagawa

IPC: H01L51/50 ,  G02F1/1368 ,  G09F9/00 ,  G09F9/35 ,  H01L21/00 ,  H01L21/336 ,  H01L21/60 ,  H01L23/48 ,  H01L27/12 ,  H01L27/32 ,  H01L29/00 ,  H01L29/786 ,  H01L51/52 ,  H01L51/56 ,  H05B33/02 ,  H05B33/14

CPC classification number: H01L24/83 ,  H01L24/17 ,  H01L24/90 ,  H01L27/12 ,  H01L27/3253 ,  H01L33/62 ,  H01L51/5268 ,  H01L51/56 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83136 ,  H01L2224/838 ,  H01L2227/326 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/01064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of manufacturing a substrate joint body by mounting a TFT on a wiring substrate includes a step of arranging an electrode pad of the wiring substrate and an electrode pad of the TFT at a predetermined interval and mechanically coupling the wiring substrate and the TFT with a adhesive and a step of electrically coupling the wiring substrate and the TFT by growing a bump from the electrode pad of the wiring substrate and/or the electrode pad of the TFT.

Abstract translation: 通过将TFT安装在布线基板上来制造基板接合体的方法包括以预定间隔布置布线基板的电极焊盘和TFT的电极焊盘，并将布线基板和TFT机械地耦合的步骤 粘合剂和通过从布线基板的电极焊盘和/或TFT的电极焊盘生长凸块来电耦合布线基板和TFT的步骤。

公开(公告)号：US09070637B2

公开(公告)日：2015-06-30

申请号：US13412951

申请日：2012-03-06

Applicant: Tsuyoshi Yoda ,  Nobuaki Hashimoto

Inventor： Tsuyoshi Yoda ,  Nobuaki Hashimoto

IPC: H01L29/40 ,  H01L31/115 ,  H01L21/44 ,  H01L23/31 ,  H01L31/0224 ,  H01L21/768 ,  H01L27/146

CPC classification number: H01L23/3114 ,  H01L21/76898 ,  H01L27/14636 ,  H01L27/14649 ,  H01L27/14692 ,  H01L31/022408 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A via hole is formed on a base substrate before a device circuit is formed, and thermal oxidation is performed to form a thermal oxidation layer on a surface of the base substrate on which the device circuit is formed and a surface in the via hole. The device circuit having a conductive section is formed on the base substrate after the thermal oxidation, and then, a conductive body is embedded in the via hole.

Abstract translation: 在形成器件电路之前，在基底基板上形成通孔，并且在形成有器件电路的基底基板的表面和通孔的表面上进行热氧化以形成热氧化层。 具有导电部分的器件电路在热氧化之后形成在基底基板上，然后将导电体嵌入通孔中。

公开(公告)号：US07390079B2

公开(公告)日：2008-06-24

申请号：US11502962

申请日：2006-08-11

Applicant: Tsuyoshi Yoda

Inventor： Tsuyoshi Yoda

IPC: B41J2/045 ,  B41J2/155

CPC classification number: H05K1/183 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1643 ,  B41J2002/14491 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/246 ,  H05K3/368 ,  H05K2201/0347 ,  H05K2201/09045 ,  H05K2201/09827 ,  H05K2203/167

Abstract: A device mounting structure includes: a base; a unit having a mounting area on which a device is mounted; a projection formed on a face of the unit; a first wiring disposed on the unit and between a top part of the projection and the mounting area; a groove provided in the base, the groove incorporating at least part of the projection; and a second wiring disposed at a bottom part of the groove in the base and electrically connected to the first wiring. The first wiring has a resin layer containing metallic particles, and a metal film on the resin layer.

Abstract translation: 一种装置安装结构，包括：底座; 具有安装在其上的装置的单元; 形成在所述单元的表面上的突起; 布置在所述单元上并位于所述突起的顶部与所述安装区域之间的第一布线; 设置在所述基座中的凹槽，所述凹槽包括所述突起的至少一部分; 以及第二布线，其布置在所述基底中的所述凹槽的底部并电连接到所述第一布线。 第一布线具有含有金属颗粒的树脂层和树脂层上的金属膜。

公开(公告)号：US07326639B2

公开(公告)日：2008-02-05

申请号：US11102903

申请日：2005-04-08

Applicant: Suguru Akagawa ,  Tsuyoshi Yoda

Inventor： Suguru Akagawa ,  Tsuyoshi Yoda

IPC: H01L21/44 ,  G02F1/1337

CPC classification number: H01L27/3276 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L27/3251 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/10156 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K3/4661 ,  H01L2924/00

Abstract: A method is provided including, after joining a wiring substrate and an element substrate, separating a second substrate of the element substrate from a semiconductor element, and electrically coupling an element-side terminal that has been exposed by the separation to a wiring-side terminal disposed outside the semiconductor element by electroless plating.

Abstract translation: 提供一种方法，其包括：在接合布线基板和元件基板之后，将元件基板的第二基板与半导体元件分离，并将已经被分离的元件侧端子电连接到布线侧端子 通过无电镀设置在半导体元件外部。

公开(公告)号：US20060164468A1

公开(公告)日：2006-07-27

申请号：US11337920

申请日：2006-01-23

Applicant: Tsuyoshi Yoda

Inventor： Tsuyoshi Yoda

IPC: B41J2/045

CPC classification number: B41J2/14233 ,  B41J2002/14419 ,  B41J2002/14491 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K3/185 ,  H05K3/32 ,  H05K3/403 ,  Y10T29/49126 ,  Y10T29/49401 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A liquid droplet ejection head that ejects liquid droplets through deformation of a driven element, includes: a first substrate having a pressurizing chamber with a nozzle aperture that ejects liquid droplets, and a first surface on which is formed a first wiring electrically connected to the drive element; a second substrate disposed on the first surface of the first substrate and covering the driven element, the second substrate having a second surface and a side surface, the second surface facing in a same direction as the first surface of the first substrate and on which is formed a second wiring, the side surface on which is formed a third wiring that combines the first wiring and the second wiring; a semiconductor element disposed on the second surface of the second substrate, and which drives the driven element; and plating that electrically connects the first wiring, the second wiring, the third wiring, and a connection terminal of the semiconductor element.

Abstract translation: 一种液滴喷射头，其通过从动元件的变形喷射液滴，包括：第一基板，具有具有喷射液滴的喷嘴孔的加压室;第一表面，其上形成有电连接到驱动器的第一布线 元件; 第二基板，设置在第一基板的第一表面上并覆盖从动元件，第二基板具有第二表面和侧表面，第二表面面向与第一基板的第一表面相同的方向， 形成第二布线，其侧面形成有组合第一布线和第二布线的第三布线; 半导体元件，设置在所述第二基板的第二表面上，并且驱动所述从动元件; 以及电连接半导体元件的第一布线，第二布线，第三布线和连接端子的电镀。

公开(公告)号：US07521797B2

公开(公告)日：2009-04-21

申请号：US11074351

申请日：2005-03-07

Applicant: Tsuyoshi Yoda ,  Suguru Akagawa

Inventor： Tsuyoshi Yoda ,  Suguru Akagawa

IPC: H01L23/48

CPC classification number: H01L24/83 ,  H01L24/17 ,  H01L24/90 ,  H01L27/12 ,  H01L27/3253 ,  H01L33/62 ,  H01L51/5268 ,  H01L51/56 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83136 ,  H01L2224/838 ,  H01L2227/326 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/01064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of manufacturing a substrate joint body by mounting a TFT on a wiring substrate includes a step of arranging an electrode pad of the wiring substrate and an electrode pad of the TFT at a predetermined interval and mechanically coupling the wiring substrate and the TFT with a adhesive and a step of electrically coupling the wiring substrate and the TFT by growing a bump from the electrode pad of the wiring substrate and/or the electrode pad of the TFT.

Abstract translation: 通过将TFT安装在布线基板上来制造基板接合体的方法包括以预定间隔布置布线基板的电极焊盘和TFT的电极焊盘，并将布线基板和TFT机械地耦合的步骤 粘合剂和通过从布线基板的电极焊盘和/或TFT的电极焊盘生长凸块来电耦合布线基板和TFT的步骤。

公开(公告)号：US20070042613A1

公开(公告)日：2007-02-22

申请号：US11502962

申请日：2006-08-11

Applicant: Tsuyoshi Yoda

Inventor： Tsuyoshi Yoda

IPC: H01R33/00

CPC classification number: H05K1/183 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1643 ,  B41J2002/14491 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/246 ,  H05K3/368 ,  H05K2201/0347 ,  H05K2201/09045 ,  H05K2201/09827 ,  H05K2203/167

Abstract: A device mounting structure includes: a base; a unit having a mounting area on which a device is mounted; a projection formed on a face of the unit; a first wiring disposed on the unit and between a top part of the projection and the mounting area; a groove provided in the base, the groove incorporating at least part of the projection; and a second wiring disposed at a bottom part of the groove in the base and electrically connected to the first wiring. The first wiring has a resin layer containing metallic particles, and a metal film on the resin layer.

Abstract translation: 一种装置安装结构，包括：底座; 具有安装在其上的装置的单元; 形成在所述单元的表面上的突起; 布置在所述单元上并位于所述突起的顶部与所述安装区域之间的第一布线; 设置在所述基座中的凹槽，所述凹槽包括所述突起的至少一部分; 以及第二布线，其布置在所述基底中的所述凹槽的底部并电连接到所述第一布线。 第一布线具有含有金属颗粒的树脂层和树脂层上的金属膜。

公开(公告)号：US20050250306A1

公开(公告)日：2005-11-10

申请号：US11102903

申请日：2005-04-08

Applicant: Suguru Akagawa ,  Tsuyoshi Yoda

Inventor： Suguru Akagawa ,  Tsuyoshi Yoda

IPC: G02F1/1345 ,  G02F1/1368 ,  G09F9/00 ,  G09F9/30 ,  H01L21/02 ,  H01L21/336 ,  H01L21/44 ,  H01L21/52 ,  H01L21/60 ,  H01L21/77 ,  H01L21/84 ,  H01L23/48 ,  H01L23/52 ,  H01L23/538 ,  H01L27/12 ,  H01L27/32 ,  H01L29/40 ,  H01L29/786 ,  H01L51/50 ,  H05B33/14

CPC classification number: H01L27/3276 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L27/3251 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/25171 ,  H01L2224/25175 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/10156 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K3/4661 ,  H01L2924/00

Abstract: A method is provided including, after joining a wiring substrate and an element substrate, separating a second substrate of the element substrate from a semiconductor element, and electrically coupling an element-side terminal that has been exposed by the separation to a wiring-side terminal disposed outside the semiconductor element by electroless plating.

Abstract translation: 提供一种方法，其包括：在接合布线基板和元件基板之后，将元件基板的第二基板与半导体元件分离，并将已经被分离的元件侧端子电连接到布线侧端子 通过无电镀设置在半导体元件外部。

公开(公告)号：US06900117B2

公开(公告)日：2005-05-31

申请号：US09984223

申请日：2001-10-29

Applicant: Tsuyoshi Yoda

Inventor： Tsuyoshi Yoda

IPC: H05K3/34 ,  H01L21/60 ,  H01L21/44

CPC classification number: H01L24/11 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/0558 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11901 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/05655

Abstract: A bump forming method having a step of patterning a resist layer so as to have a penetrating hole above a pad, a step of applying energy to cause cross-linking in the resist layer, and hardening at least a surface of the resist layer, and a step of forming a metal layer electrically connected to the pad within the penetrating hole.

Abstract translation: 一种凸块形成方法，具有将抗蚀剂层图案化以具有在焊盘上方的贯通孔的步骤，施加能量以在抗蚀剂层中引起交联并使至少抗蚀剂层的表面硬化的步骤，以及 形成与贯通孔内的焊盘电连接的金属层的工序。

公开(公告)号：US08839520B2

公开(公告)日：2014-09-23

申请号：US12844373

申请日：2010-07-27

Applicant: Tsuyoshi Yoda

Inventor： Tsuyoshi Yoda

IPC: B21D53/76 ,  B23P17/00 ,  H05K3/36 ,  B41J2/14 ,  H05K3/40 ,  H05K3/18 ,  H05K1/03 ,  H05K3/32

CPC classification number: B41J2/14233 ,  B41J2002/14419 ,  B41J2002/14491 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K3/185 ,  H05K3/32 ,  H05K3/403 ,  Y10T29/49126 ,  Y10T29/49401 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of manufacturing a device that has a semiconductor element includes: forming a first wiring on a first surface of a first member; forming a second wiring on a second surface of a second member with a gap from a connection terminal and a third wiring on an inclined plane of the second member, the second member being disposed on the first member so that the first and second surfaces face in the same direction, the third wiring being aligned with, and connecting, the first and second wirings; disposing the semiconductor element on the first or second surface; and providing plating that electrically connects the first, second and third wiring with the connection terminal, wherein the connection terminal faces the second wiring, and the plating is provided in the gap between the connection terminal and the second wiring.

Abstract translation: 一种制造具有半导体元件的器件的方法包括：在第一部件的第一表面上形成第一布线; 在第二构件的第二表面上形成与第二构件的倾斜平面上的连接端子和第三布线间隙的第二布线，第二构件设置在第一构件上，使得第一和第二表面面向 相同的方向，第三布线与第一布线和第二布线对准并连接; 将半导体元件设置在第一或第二表面上; 并且提供将所述第一，第二和第三布线与所述连接端子电连接的电镀，其中所述连接端子面向所述第二布线，并且所述电镀设置在所述连接端子和所述第二布线之间的间隙中。