公开(公告)号：US20160225568A1

公开(公告)日：2016-08-04

申请号：US14611307

申请日：2015-02-02

Applicant: UNEO Inc.

Inventor： Cheng-Tsung CHEN ,  Hsin-Lin YU ,  Chih-Sheng HOU ,  Chia-Hung CHOU

IPC: H01H57/00

CPC classification number: H03K17/964 ,  H01H2221/09

Abstract: An embedded button without having gap is disclosed according to the present invention. The button area just bends to operate instead of moving back and forth to operate within a through hole so that no water, vapor, or dust shall enter into the device. One of the embodiment comprises an inner bump configured on an inner side of an outer frame; a pressure switch is configured under the inner bump and touches the bottom surface of the bump; and an activating electrical signal is triggered when the button area is pressed by user with a force exceeding a threshold force level from outside surface of the outer frame of the electronic device.

Abstract translation: 根据本发明公开了一种没有间隙的嵌入按钮。 按钮区域只是弯曲而不是来回移动以在通孔内操作，使得水，蒸气或灰尘不能进入设备。 实施例中的一个包括构造在外框架的内侧上的内凸块; 压力开关构造在内凸块下方并碰到凸块的底面; 并且当用户以超过电子设备的外框架的外表面的力超过阈值力水平的力按下按钮区域时，触发启动电信号。

公开(公告)号：US20240314938A1

公开(公告)日：2024-09-19

申请号：US18185041

申请日：2023-03-16

Applicant: UNEO INC.

Inventor： Chih-Sheng HOU ,  Chia-Hung CHOU ,  Hsin-Lin YU ,  Si-Wei CHEN ,  Chueh CHIANG

IPC: H05K3/32 ,  H05K1/03

CPC classification number: H05K3/32 ,  H05K1/038 ,  H05K2201/0145 ,  H05K2201/029 ,  H05K2201/10287

Abstract: The present invention relates to an extension structure of flexible substrates with conductive wires thereon. In a first embodiment, three flexible substrates are prepared, each having multiple conductive wires configured on their front surfaces. The third flexible substrate is flipped over, with its conductive wires facing downwards, and bonded across a boundary formed by the first and second flexible substrates. As a result, the corresponding conductive wires between the first and second flexible substrates are electrically coupled with each other through being physically pressed by corresponding conductive wires in the third flexible substrate.