公开(公告)号：US10580951B2

公开(公告)日：2020-03-03

申请号：US16040546

申请日：2018-07-20

Applicant: UNIFLEX Technology Inc.

Inventor： Yi-Chun Liu ,  Ying-Hsing Chen ,  Bo-Hua Chen ,  Yuan-Chih Lee

IPC: H01L33/58 ,  H01L33/62 ,  H01L33/60 ,  H01L33/48

Abstract: A package structure for a backlight module includes a flexible base film, a plurality of pads, a light-emitting component, a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. In addition, a material of the flexible base film includes polyimide and white fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component is disposed on the pads and electrically connected to the pads. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.

公开(公告)号：US20190305200A1

公开(公告)日：2019-10-03

申请号：US16040546

申请日：2018-07-20

Applicant: UNIFLEX Technology Inc.

Inventor： Yi-Chun Liu ,  Ying-Hsing Chen ,  Bo-Hua Chen ,  Yuan-Chih Lee

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/60

Abstract: A package structure for a backlight module includes a flexible base film, a plurality of pads, a light-emitting component, a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. In addition, a material of the flexible base film includes polyimide and white fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component is disposed on the pads and electrically connected to the pads. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.