公开(公告)号：US20140151107A1

公开(公告)日：2014-06-05

申请号：US13845325

申请日：2013-03-18

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： CHENG-MING WENG ,  WEI-MING CHENG ,  HAN-PEI HUANG

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K3/0032 ,  H05K3/42 ,  H05K3/426 ,  H05K2201/09563 ,  H05K2201/09709 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49165

Abstract: A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.

Abstract translation: 布线基板包括基板，第一导体层，第二导体层和通孔导体。 衬底具有第一表面，第二表面和至少一个通孔。 第一导体层形成在第一表面上，第二导体层形成在第二表面上。 通孔导体形成在用于电连接到第一导体层和第二导体层的通孔中。 通孔具有暴露在第一表面中的第一凹陷部分，暴露在第二表面中的第二凹部，以及在第一凹陷部分和第二凹陷部分之间的用于连接第一凹陷部分和第二凹陷部分的隧道部分 。 第一凹陷部分和第二凹陷部分是非同轴的。

公开(公告)号：US20140151099A1

公开(公告)日：2014-06-05

申请号：US13845339

申请日：2013-03-18

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： CHENG MING WENG ,  WEI-MING CHENG ,  HAN-PEI HUANG

IPC: H05K1/11 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K1/0366 ,  H05K3/0035 ,  H05K2201/09827

Abstract: A laser drilling method of a wiring board is provided. In the method, a laser beam shines on a wiring substrate including an insulating layer to remove a portion of the insulating layer. The wiring substrate is placed in a focus section of the laser beam. The focus section contains a central region, an optical axis located in the central region, and a peripheral region surrounding the central region. The maximum light intensity of the focus section is located in the peripheral region.

Abstract translation: 提供一种布线板的激光钻孔方法。 在该方法中，激光束照射在包括绝缘层的布线基板上，以去除绝缘层的一部分。 布线基板被放置在激光束的聚焦部分中。 焦点部分包含中心区域，位于中心区域的光轴以及围绕中心区域的周边区域。 焦点部分的最大光强度位于周边区域。