公开(公告)号：US20140076492A1

公开(公告)日：2014-03-20

申请号：US14084901

申请日：2013-11-20

Applicant: UNIMICRON TECHNOLOGY CORPORATION

Inventor： Chien-Kuang Lai ,  Chun-Chih Huang

IPC: H01G4/30

CPC classification number: H01G4/30 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/642 ,  H01L28/40 ,  H01L2924/0002 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/10015 ,  H05K2201/10515 ,  H01L2924/00

Abstract: A packaging substrate includes: a substrate having a core layer, a cavity penetrating the core layer and circuit layers formed on surfaces of the core layer; a first capacitor disposed in the cavity; a bonding layer formed on the first capacitor in the cavity of the substrate; a second capacitor disposed on the bonding layer so as to be received in the cavity; and a dielectric layer formed on the substrate and in the cavity for covering the first and second capacitors. By stacking the first and second capacitors in the cavity through the bonding layer, the single core layer is embedded with two layers of the capacitors to thereby meet the multi-function requirement.

Abstract translation: 封装基板包括：具有芯层的基板，穿透芯层的空腔和形成在芯层表面上的电路层; 设置在所述空腔中的第一电容器; 形成在所述基板的空腔中的所述第一电容器上的接合层; 设置在所述接合层上以便容纳在所述空腔中的第二电容器; 以及形成在所述基板上和所述空腔中的用于覆盖所述第一和第二电容器的电介质层。 通过结合层将空腔中的第一和第二电容器堆叠起来，单芯层嵌有两层电容器，从而满足多功能要求。