公开(公告)号：US20160107885A1

公开(公告)日：2016-04-21

申请号：US14862504

申请日：2015-09-23

Applicant: UNIVERSITAET STUTTGART

Inventor： PATRICK SCHALBERGER ,  NORBERT FRUEHAUF ,  MARCUS HERRMANN

IPC: B81C1/00 ,  H01L21/44 ,  H01L21/465 ,  H01L21/28 ,  H01L29/66 ,  H01L21/306

CPC classification number: B81C1/00246 ,  B81C2201/0133 ,  B81C2203/0742 ,  H01L21/28 ,  H01L21/30604 ,  H01L21/44 ,  H01L21/465 ,  H01L29/1604 ,  H01L29/24 ,  H01L29/247 ,  H01L29/6609 ,  H01L29/66143 ,  H01L29/66757 ,  H01L29/66969 ,  H01L29/872

Abstract: A method for the fabrication of thin-film transistors together with micromechanical components, other active electrical components or both on an amorphous or polycrystalline substrate includes disposing the thin-film transistors and the other components on different areas of the substrate.

Abstract translation: 用于在非晶或多晶衬底上与微机械部件，其它有源电气部件或两者一起制造薄膜晶体管的方法包括将薄膜晶体管和其它部件设置在衬底的不同区域上。