Abstract:
The present invention relates to novel silica materials, precursors thereof and the preparation thereof. The compounds may be used for a variety of applications, including chromatography and catalysis.
Abstract:
A method for at least partially sealing a porous material is provided, comprising forming a sealing layer onto the porous material by applying a sealing compound comprising oligomers wherein the oligomers are formed by ageing a precursor solution comprising cyclic carbon bridged organosilica and/or bridged organosilanes. The method is especially designed for low k dielectric porous materials to be incorporated into semiconductor devices.
Abstract:
The present invention relates to novel silica materials, precursors thereof and the preparation thereof. The compounds may be used for a variety of applications, including chromatography and catalysis.
Abstract:
A method for at least partially sealing a porous material is provided, comprising forming a sealing layer onto the porous material by applying a sealing compound comprising oligomers wherein the oligomers are formed by ageing a precursor solution comprising cyclic carbon bridged organosilica and/or bridged organosilanes. The method is especially designed for low k dielectric porous materials to be incorporated into semiconductor devices.