APPARATUS AND METHOD OF MAKING MODULAR INTERCONNECTIONS FOR ELECTRONIC CIRCUITS

    公开(公告)号:US20240431036A1

    公开(公告)日:2024-12-26

    申请号:US18703098

    申请日:2022-10-24

    Abstract: Approaches to producing modular electronic packages include modular arrangements that operate from DC up to 110 GHz and are presented using additive manufacturing such as 3D printing and laser-machining. A method includes assembling electrical circuits from circuit components positioned on modular substrate sections by identifying respective positions of selected components of the electrical circuits on an original substrate; mapping a cut path across the original substrate, wherein the cut path is determined by the respective positions of the selected components; cutting the original substrate along the cut path, wherein the cut path separates the selected components of the electrical circuits onto substrate pieces defining respective side portions; and mating the respective side portions of the respective substrate pieces with corresponding side portions of other substrate sections to assemble the electrical circuits across substrate junctions.

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