公开(公告)号：US20130105971A1

公开(公告)日：2013-05-02

申请号：US13723090

申请日：2012-12-20

Applicant: Ultratech, Inc.

Inventor： Timothy H. Daubenspeck ,  Timothy D. Sullivan

IPC: H01L23/488

CPC classification number: H01L23/488 ,  H01L24/05 ,  H01L24/13 ,  H01L24/45 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05022 ,  H01L2224/05541 ,  H01L2224/05557 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/13007 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45147 ,  H01L2224/48824 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Structure and methods of making the structures. The structures include a structure, comprising: an organic dielectric passivation layer extending over a substrate; an electrically conductive current spreading pad on a top surface of the organic dielectric passivation layer; an electrically conductive solder bump pad comprising one or more layers on a top surface of the current spreading pad; and an electrically conductive solder bump containing tin, the solder bump on a top surface of the solder bump pad, the current spreading pad comprising one or more layers, at least one of the one or more layers consisting of a material that will not form an intermetallic with tin or at least one of the one or more layers is a material that is a diffusion barrier to tin and adjacent to the solder bump pad.

Abstract translation: 制作结构的结构和方法。 所述结构包括结构，包括：在衬底上延伸的有机介电钝化层; 在所述有机介电钝化层的顶表面上的导电电流扩散焊盘; 导电焊料凸块焊盘，其在电流扩散焊盘的顶表面上包括一层或多层; 以及包含锡的导电焊料凸块，所述焊料凸块在所述焊料凸块焊盘的顶表面上，所述电流扩散焊盘包括一个或多个层，所述一个或多个层中的至少一个由不会形成 金属间化合物与锡或一层或多层中的至少一层是对锡的扩散阻挡层并且与焊料凸块相邻的材料。

公开(公告)号：US08580673B2

公开(公告)日：2013-11-12

申请号：US13736627

申请日：2013-01-08

Applicant: Ultratech, Inc.

Inventor： Timothy H. Daubenspeck ,  Jeffrey P. Gambino ,  Christopher D. Muzzy ,  Marie-Claude Paquet ,  Wolfgang Sauter ,  Timothy D. Sullivan

IPC: H01L21/44

CPC classification number: H01L21/56 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/743 ,  H01L24/97 ,  H01L29/0657 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00

Abstract: Underfill flow guide structures and methods of using the same are provided with a module. In particular the underfill flow guide structures are integrated with a substrate and are configured to prevent air entrapment from occurring during capillary underfill processes.

Abstract translation: 底部填充流动引导结构及其使用方法具有模块。 特别地，底部填充流动引导结构与基底一体化并且被构造成防止在毛细管底部填充过程期间发生空气滞留。

公开(公告)号：US08669660B2

公开(公告)日：2014-03-11

申请号：US13723090

申请日：2012-12-20

Applicant: Ultratech, Inc.

Inventor： Timothy H. Daubenspeck ,  Timothy D. Sullivan

IPC: H01L23/488

CPC classification number: H01L23/488 ,  H01L24/05 ,  H01L24/13 ,  H01L24/45 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05022 ,  H01L2224/05541 ,  H01L2224/05557 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/13007 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45147 ,  H01L2224/48824 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Structure and methods of making the structures. The structures include a structure, comprising: an organic dielectric passivation layer extending over a substrate; an electrically conductive current spreading pad on a top surface of the organic dielectric passivation layer; an electrically conductive solder bump pad comprising one or more layers on a top surface of the current spreading pad; and an electrically conductive solder bump containing tin, the solder bump on a top surface of the solder bump pad, the current spreading pad comprising one or more layers, at least one of the one or more layers consisting of a material that will not form an intermetallic with tin or at least one of the one or more layers is a material that is a diffusion barrier to tin and adjacent to the solder bump pad.

Abstract translation: 制作结构的结构和方法。 所述结构包括结构，包括：在衬底上延伸的有机介电钝化层; 在所述有机介电钝化层的顶表面上的导电电流扩散焊盘; 导电焊料凸块焊盘，其在电流扩散焊盘的顶表面上包括一层或多层; 以及包含锡的导电焊料凸块，所述焊料凸块在所述焊料凸块焊盘的顶表面上，所述电流扩散焊盘包括一个或多个层，所述一个或多个层中的至少一个由不会形成 金属间化合物与锡或一层或多层中的至少一层是对锡的扩散阻挡层并且与焊料凸块相邻的材料。