公开(公告)号：US20220189923A1

公开(公告)日：2022-06-16

申请号：US17182258

申请日：2021-02-23

Applicant: Unimicron Technology Corp.

Inventor： Tzu-Hsuan WANG ,  Chen-Hsien LIU

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/00 ,  H01L23/433 ,  H01L21/56 ,  H01L21/768

Abstract: A chip package structure includes a wiring board, a first chip, a second chip, a thermally conductive material, a molding compound and a heat dissipation part. The wiring board includes a plurality of circuit pads. The first chip is mounted on the wiring board and is electrically connected to at least one of the circuit pads. The first chip is located between the second chip and the wiring board. The thermally conductive material is located on the wiring board and penetrates the second chip and the first chip to extend to the wiring board. The molding compound is disposed on the wiring board, and the heat dissipation part is disposed on the molding material and thermally coupled to the thermally conductive material.