公开(公告)号：US20210159142A1

公开(公告)日：2021-05-27

申请号：US17165892

申请日：2021-02-02

Applicant: Unimicron Technology Corp.

Inventor： Tzu-Hsuan WANG ,  Chien-Chen LIN ,  Kuan-Wen FONG

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/13 ,  H01L21/48 ,  H01L23/00

Abstract: A chip package structure includes a circuit structure, a redistribution structure, a heat conductive component, a chip, and a heat sink. The circuit structure includes a first circuit layer. The redistribution structure is disposed on the circuit structure and includes a second circuit layer, wherein the redistribution structure has an opening. The heat conductive component is disposed on the circuit structure and covered by the redistribution structure. The heat conductive component has a horizontal portion and a vertical portion. The horizontal portion extends toward the opening until it exceeds the opening. The vertical portion extends upward beyond the top surface of the redistribution structure from a part of the horizontal portion. The chip is disposed in the opening, and the bottom of the chip contacts the heat conductive component. The heat sink is disposed over the redistribution structure and the chip.

公开(公告)号：US20220189923A1

公开(公告)日：2022-06-16

申请号：US17182258

申请日：2021-02-23

Applicant: Unimicron Technology Corp.

Inventor： Tzu-Hsuan WANG ,  Chen-Hsien LIU

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/00 ,  H01L23/433 ,  H01L21/56 ,  H01L21/768

Abstract: A chip package structure includes a wiring board, a first chip, a second chip, a thermally conductive material, a molding compound and a heat dissipation part. The wiring board includes a plurality of circuit pads. The first chip is mounted on the wiring board and is electrically connected to at least one of the circuit pads. The first chip is located between the second chip and the wiring board. The thermally conductive material is located on the wiring board and penetrates the second chip and the first chip to extend to the wiring board. The molding compound is disposed on the wiring board, and the heat dissipation part is disposed on the molding material and thermally coupled to the thermally conductive material.

公开(公告)号：US20210050288A1

公开(公告)日：2021-02-18

申请号：US16595491

申请日：2019-10-08

Applicant: Unimicron Technology Corp.

Inventor： Tzu-Hsuan WANG

IPC: H01L23/498 ,  H01L23/367 ,  H01L23/13 ,  H01L21/48

Abstract: A circuit carrier includes a substrate, a laminar circuit structure, a metal heat slug, a first fixing piece, and a second fixing piece. The laminar circuit structure is disposed over the substrate and includes a plurality of dielectric layers and circuits in the dielectric layers. The metal heat slug is disposed in the laminar circuit structure. The first fixing piece is disposed on the first side of the upper surface of the metal heat slug. The second fixing piece is disposed on the second side of the upper surface of the metal heat slug, wherein the first side is perpendicular to the second side. A method of manufacturing a circuit carrier is also provided herein.