公开(公告)号：US20230284376A1

公开(公告)日：2023-09-07

申请号：US17662432

申请日：2022-05-08

Applicant: Unimicron Technology Corp.

Inventor： Chun-Hung KUO

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K1/115 ,  H05K3/32 ,  H05K3/40 ,  H05K2201/068 ,  H05K2201/10378

Abstract: An electronic circuit assembly includes an interposer substrate, a wiring substrate, an electrical connective part and an electronic component. The interposer substrate with a first coefficient of thermal expansion (CTE) includes a first surface, a second surface opposite to the first surface, and a first side surface connecting to the first surface and the second surface. The wiring substrate with a second CTE is disposed below the second surface. The first CTE is lower than the second CTE. The electrical connective part is disposed in the interposer substrate and extends to the first side surface. The electronic component is attached to the first side surface and is electrically connected to the electrical connective part.

公开(公告)号：US20230371189A1

公开(公告)日：2023-11-16

申请号：US17810340

申请日：2022-06-30

Applicant: Unimicron Technology Corp.

Inventor： Chun-Hung KUO

IPC: H05K3/46 ,  H05K3/00 ,  H05K3/06

CPC classification number: H05K3/4644 ,  H05K3/0041 ,  H05K3/062 ,  H05K2203/0554 ,  H05K2203/095

Abstract: A method for manufacturing a circuit board includes providing a composite material film including a metal film and a polymeric film, disposing a dielectric layer on the polymeric film to form a stacked structure, forming a circuit layer with a contact pad on a substrate, bonding the stacked structure onto the substrate and the circuit layer, and forming a first opening extending through the metal film to form a patterned metal film. The dielectric layer directly contacts the substrate and entirely covers the circuit layer. The method further includes plasma etching the dielectric layer with the patterned metal film as a mask to form a second opening in the dielectric layer and expose the contact pad in the second opening, removing the composite material film, and depositing a conductive material in the second opening to form a conductive blind hole electrically connected to the contact pad.

公开(公告)号：US20230319990A1

公开(公告)日：2023-10-05

申请号：US17662224

申请日：2022-05-05

Applicant: Unimicron Technology Corp.

Inventor： Chun-Hung KUO

IPC: H05K1/11 ,  H05K3/46

CPC classification number: H05K1/111 ,  H05K3/4644

Abstract: The present disclosure provides a circuit board and its manufacturing method. The circuit board includes a first circuit layer, a first conductive post, and a second circuit layer. The first circuit layer includes a first pad and a first seed layer covering a sidewall of the first pad. The first conductive post is on the first pad and directly connected to the first pad. The second circuit layer includes a second pad and a second seed layer covering a sidewall of the second pad. The second pad is on a first connecting end of the first conductive post. The first connecting end is embedded in the second pad, and the second pad is connected to and directly contacts the first connecting end. The first seed layer and the second seed layer do not extend on a sidewall of the first conductive post.