公开(公告)号：US09237643B2

公开(公告)日：2016-01-12

申请号：US13726405

申请日：2012-12-24

Applicant: Unimicron Technology Corp.

Inventor： Tsung-Yuan Chen ,  Shu-Sheng Chiang ,  David C. H. Cheng

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/04 ,  H05K3/10 ,  H05K3/46 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/02 ,  H05K1/0265 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/045 ,  H05K3/107 ,  H05K3/426 ,  H05K3/465 ,  H05K2201/0352 ,  H05K2201/09736 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A circuit board structure including a dielectric layer, a fine circuit pattern and a patterned conductive layer is provided, wherein the fine circuit pattern is embedded in a surface of the dielectric layer, and the patterned conductive layer is disposed on another surface of the dielectric layer and protrudes therefrom.

Abstract translation: 提供了包括电介质层，精细电路图案和图案化导电层的电路板结构，其中微电路图案嵌入在电介质层的表面中，并且图案化导电层设置在电介质层的另一表面上 并从其突出。

公开(公告)号：US20130105202A1

公开(公告)日：2013-05-02

申请号：US13726405

申请日：2012-12-24

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Tsung-Yuan Chen ,  Shu-Sheng Chiang ,  David C. H. Cheng

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/02 ,  H05K1/0265 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/045 ,  H05K3/107 ,  H05K3/426 ,  H05K3/465 ,  H05K2201/0352 ,  H05K2201/09736 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A circuit board structure including a dielectric layer, a fine circuit pattern and a patterned conductive layer is provided, wherein the fine circuit pattern is embedded in a surface of the dielectric layer, and the patterned conductive layer is disposed on another surface of the dielectric layer and protrudes therefrom.

Abstract translation: 提供了包括电介质层，精细电路图案和图案化导电层的电路板结构，其中微电路图案嵌入在电介质层的表面中，并且图案化导电层设置在电介质层的另一表面上 并从其突出。