公开(公告)号：US11765826B2

公开(公告)日：2023-09-19

申请号：US17157294

申请日：2021-01-25

Applicant: Qorvo US, Inc.

Inventor： John August Orlowski ,  Thomas Scott Morris ,  David Jandzinski

IPC: H05K3/00 ,  H05K1/11 ,  H05K3/24 ,  H05K3/40

CPC classification number: H05K1/113 ,  H05K3/0041 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/09736

Abstract: Electronic substrates, contact pads for electronic substrates, and related methods are disclosed. Electronic substrates may include an electrically conductive layer that forms at least one contact pad and at least one metal trace on a non-conductive layer. The contact pads are arranged with greater thicknesses or heights above the non-conductive layer than the metal traces. Dielectric layers are disclosed that cover the metal traces while leaving top surfaces of the contact pads exposed. Top surfaces of the dielectric layers may be arranged to be coplanar with top surfaces of the contact pads to provide electronic substrates having generally planar top faces. Bottom faces of electronic substrates may include mounting pads that are coplanar with additional dielectric layers. Methods are disclosed that include forming dielectric layers to cover contact pads and metal traces, and removing surface portions of the dielectric layers until the contact pads are accessible through the dielectric layers.

公开(公告)号：US20180317318A1

公开(公告)日：2018-11-01

申请号：US15950479

申请日：2018-04-11

Applicant: Seiko Epson Corporation

Inventor： Yohei YAMADA ,  Tomoyuki KAMAKURA

IPC: H05K1/02 ,  H05K1/18 ,  G01B7/16

CPC classification number: H05K1/0283 ,  G01B7/20 ,  H05K1/111 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/0191 ,  H05K2201/09281 ,  H05K2201/09736 ,  H05K2201/10151 ,  H05K2201/10439 ,  H05K2201/2009 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A stretchable circuit board includes a stretchable substrate, a stretchable conducting film placed on one surface of the stretchable substrate and elongated in a first direction, an electric element placed on the one surface of the stretchable substrate, and a covering portion that covers a part of the stretchable conducting film and at least a part of the electric element, wherein, when an area of a first section as a section along an outer circumference of the covering portion in the stretchable conducting film is referred to as a first area and an area of a second section as a section of the stretchable conducting film orthogonal to the first direction in a location apart from the outer circumference of the covering portion toward outside is referred to as a second area, the first area is larger than the second area.

公开(公告)号：US20180112861A1

公开(公告)日：2018-04-26

申请号：US15572703

申请日：2016-05-21

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： JORIS HUBERTUS ANTONIUS HAGELAAR ,  AART JAN VROEGOP

IPC: F21V23/00 ,  F21S4/22 ,  H05K1/03 ,  H05K3/12 ,  H05K1/18 ,  H05K3/30

CPC classification number: F21V23/001 ,  F21S4/22 ,  F21V23/005 ,  F21Y2103/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0821 ,  H05K1/025 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/189 ,  H05K3/12 ,  H05K3/303 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10106

Abstract: The present invention provides a light emitting diode(s), LED, light strip arranged for providing improved color consistency over its length. The LED light strip comprises LED strings positioned along the length of the LED light strip and powered in parallel, for emitting, for example, red, green, blue and white light. The resistance of the supply and return traces, in combination with variations in the current drawn by or the forward voltage of the various LED and resistors used in the LED strings of different color, causes a voltage drop along these traces leading to inconsistent color rendering. By adjusting the resistivity of the traces, such as through providing return paths having different resistances for LED strings of different color, the consistency of the color rendering can be improved.

公开(公告)号：US09930773B2

公开(公告)日：2018-03-27

申请号：US15188453

申请日：2016-06-21

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Michael David Dickey

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/46 ,  G06F1/16

CPC classification number: H05K1/0272 ,  G06F1/1613 ,  H01R12/59 ,  H01R12/77 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/03 ,  H05K1/092 ,  H05K1/148 ,  H05K3/10 ,  H05K3/1275 ,  H05K3/361 ,  H05K3/4644 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/055 ,  H05K2201/09009 ,  H05K2201/09736 ,  H05K2203/0776

Abstract: Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.

公开(公告)号：US20180070440A1

公开(公告)日：2018-03-08

申请号：US15560439

申请日：2016-03-17

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Akihiko HANYA

IPC: H05K1/02

CPC classification number: H05K1/0231 ,  H01L2224/16225 ,  H05K1/0265 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/1275 ,  H05K3/1283 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/0391 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2203/1131 ,  H05K2203/1581

Abstract: An electronic device capable of supplying a large current to a circuit pattern containing conductive nanoparticles includes a substrate, a region provided on the substrate, configured to mount an electronic component therein, a first circuit pattern placed within the region and electrically connected to the electronic component, a second circuit pattern connected to the first circuit pattern and configured to supply current to the first circuit pattern from outside of the region. At least a part of the first circuit pattern includes a layer obtained by sintering conductive nanosized particles with a diameter of less than 1 μm. The second circuit pattern is thicker than the first circuit pattern.

公开(公告)号：US09854687B2

公开(公告)日：2017-12-26

申请号：US14923034

申请日：2015-10-26

Applicant: FINISAR CORPORATION

Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Hongyu Deng

IPC: H05K3/46 ,  H05K3/30 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4682 ,  H05K1/0242 ,  H05K1/113 ,  H05K3/303 ,  H05K3/4667 ,  H05K3/467 ,  H05K3/4688 ,  H05K2201/0391 ,  H05K2201/094 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10121

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.

公开(公告)号：US20170358513A1

公开(公告)日：2017-12-14

申请号：US15522322

申请日：2015-10-29

Applicant: Kyocera Corporation

Inventor： Yuuichi Abe

IPC: H01L23/36 ,  H05K3/46 ,  H01L23/13 ,  H05K3/40 ,  H05K1/11

CPC classification number: H01L23/36 ,  H01L23/13 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H05K1/02 ,  H05K1/11 ,  H05K1/183 ,  H05K3/40 ,  H05K3/46 ,  H05K2201/09427 ,  H05K2201/09736 ,  H05K2201/20

Abstract: A circuit board includes: a base body formed of ceramics or sapphire, the base body being provided with a through hole which penetrates therethrough from one principal face to another principal face of the base body; a through conductor containing silver as a major constituent, the through conductor being located inside the through hole of the base body; metallic wiring layers located on the respective principal faces of the base body and on the through conductor; and regions in which a compound containing at least one substance selected from Sn, Cu, and Ni is present between the through conductor and the metallic wiring layers.

公开(公告)号：US09706643B2

公开(公告)日：2017-07-11

申请号：US14727892

申请日：2015-06-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tomoko Iwama

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H01L2224/33 ,  H01L2924/181 ,  H05K1/187 ,  H05K1/188 ,  H05K3/0014 ,  H05K3/4614 ,  H05K2201/0133 ,  H05K2201/0338 ,  H05K2201/037 ,  H05K2201/0382 ,  H05K2201/068 ,  H05K2201/09736 ,  H05K2203/063 ,  H05K2203/1327 ,  Y10T29/49131 ,  H01L2924/00012

Abstract: An electronic device according to the present disclosure includes a component, an electrode placed on the component, a conductor which includes a first conductor section, including an electrode contact surface in contact with the electrode, and two second conductor sections, electrically connected to two respective facing edges of the first conductor section to extend in respective directions away from the electrode and including respective inclined surfaces inclined in directions toward a central axis passing through a center of the electrode and perpendicular to the surface of the electrode, an insulator which is in contact with the two second conductor sections from sides opposite to the central axis and encloses the conductor and the electrode, and a case housing the component, the electrode, the conductor, and the insulator. A space without the insulator is defined between the two second conductor sections.

公开(公告)号：US09648755B2

公开(公告)日：2017-05-09

申请号：US14772888

申请日：2014-12-17

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Adrianus Johannes Stephanus Maria De Vaan ,  Wilhelmus Gerardus Maria Peels ,  Josephus Paulus Augustinus Deeben

IPC: H05K3/02 ,  H05K3/32 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/12 ,  H05K3/44 ,  H05K1/05

CPC classification number: H05K3/32 ,  H05K1/0284 ,  H05K1/056 ,  H05K1/092 ,  H05K3/0014 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/321 ,  H05K3/44 ,  H05K2201/0129 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2203/1461

Abstract: A method for manufacturing a non-planar printed circuit board assembly (1) is disclosed. The method comprises providing a planar formable substrate (2) for supporting a conductive material (3) and at least one electronic component (4), printing a circuit pattern of an uncured conductive material (3) on the planar substrate (2), forming the substrate (2) and the uncured conductive material (3) into a non-planar shape, and curing the conductive material (3), wherein the substrate (2) comprises a metal sheet and an electrically insulating coating (2b) arranged between the metal sheet and the conductive material (3).

公开(公告)号：US09610762B2

公开(公告)日：2017-04-04

申请号：US14883213

申请日：2015-10-14

Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA

Inventor： Takeshi Fujimoto

IPC: B41F15/26 ,  B41F15/08 ,  B41F15/36 ,  H05K3/12 ,  H05K3/34 ,  B41F1/38

CPC classification number: B41F15/0881 ,  B41F1/38 ,  B41F15/26 ,  B41F15/36 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2201/09736 ,  H05K2203/1476 ,  H05K2203/165

Abstract: A board printing apparatus includes a board working table, a first printing table, a second printing table, and a control portion controlling printing operations. The control portion is configured to perform second printing on a board held by the board working table by a large component mask of the second printing table after a first printing performed on the board held by the board working table by a small component mask of the first printing table.