公开(公告)号：US20250149440A1

公开(公告)日：2025-05-08

申请号：US18393771

申请日：2023-12-22

Applicant: United Microelectronics Corp.

Inventor： Chien-Yi LEE ,  Tse-Pu Chen ,  Yi-Chin Li ,  Sheng-Huei Dai

IPC: H01L23/522 ,  H01L29/94

Abstract: An electronic device including a substrate with a trench and an inductor disposed on the substrate is provided. The inductor includes a first conductive layer and a second conductive layer. The first conductive layer is conformally disposed on the substrate. At least a portion of the first conductive layer is disposed in the trench. The first conductive layer has a first end portion and a second end portion. The second conductive layer is conformally disposed on the first conductive layer. The second conductive layer has a first end portion and a second end portion on the first end portion of the first conductive layer and the second end portion of the first conductive layer, respectively. The first end portion of the second conductive layer is electrically connected with the second end portion of the first conductive layer.