公开(公告)号：US11942379B1

公开(公告)日：2024-03-26

申请号：US18359661

申请日：2023-07-26

Applicant: Unity Semiconductor

Inventor： Dario Alliata ,  Jean-François Boulanger

IPC: H01L21/66 ,  G01N21/95

CPC classification number: H01L22/12 ,  G01N21/9501 ,  H01L22/20

Abstract: A measurement system and an inspection method for detecting a defective bonding interface in a sample substrate including at least one element disposed on a support. The method comprises: placing the sample substrate in the measurement system, establishing an inclination map of the exposed surface, analyzing the inclination map and identifying a zone or zones of the exposed surface whose inclinations deviate by more than a given threshold from the inclination of the reference surface; and detecting the presence of a defective bond between the element and the support, depending on the result of the analysis of the inclination map.