公开(公告)号：US20190207056A1

公开(公告)日：2019-07-04

申请号：US16333923

申请日：2017-07-26

Applicant: VALEO VISION

Inventor： Nicolas LEFAUDEX ,  Antoine DE LAMBERTERIE ,  Guillaume THIN ,  Samira MBATA ,  Thomas CANONNE ,  Van Thai HOANG ,  Vincent DUBOIS ,  Francois-Xavier AMIEL

IPC: H01L33/00 ,  H01L27/15 ,  H01L23/00

CPC classification number: H01L33/0079 ,  F21S43/14 ,  F21S43/195 ,  H01L24/05 ,  H01L24/80 ,  H01L24/94 ,  H01L25/167 ,  H01L27/156 ,  H01L2224/05571 ,  H01L2224/05647

Abstract: A process for mounting a light component on a carrier. The light component includes a generally planar substrate, on a first face of which submillimetre-sized electroluminescent semiconductor elements are epitaxied in the form of a matrix. The process is noteworthy in that it eliminates the need for a layer of filler material between the component and the carrier, while providing good thermal and electrical conductivity between the component and the carrier and high mechanical strength.