公开(公告)号：US20240183524A1

公开(公告)日：2024-06-06

申请号：US18551736

申请日：2022-03-23

Applicant: VALEO VISION

Inventor： Thibaut MENN ,  Laurent VIVET ,  Renan LEON ,  Jean-Francois BISSON ,  Baptiste DECROUY ,  Guillaume BONVALLAT

IPC: F21V29/76 ,  B23K26/0622 ,  B23K26/352 ,  F21S41/143 ,  F21S43/14 ,  F21S45/48 ,  F21Y115/10 ,  F28F13/18

CPC classification number: F21V29/767 ,  B23K26/0622 ,  B23K26/3584 ,  F21S45/48 ,  F28F13/185 ,  F21S41/143 ,  F21S43/14 ,  F21Y2115/10

Abstract: A heat sink for an electronic component and its manufacturing method by applying a nanopulsed laser. The heat sink includes a body provided with an outer layer, including a surface layer having a radiative exposed surface and a layer immediately underlying the surface layer. The underlying layer is made of a material based on a metal and the surface layer is made of an oxide of said material. The outer layer includes juxtaposed nodules. The heat sink originally combines a surface chemical state promoting heat emission and a structure geometrically promoting heat exchange, in order to synergistically improve its heat dissipation capability.