METHOD AND DEVICES FOR PLASMA TREATMENT
    1.
    发明公开

    公开(公告)号:US20240222088A1

    公开(公告)日:2024-07-04

    申请号:US18557382

    申请日:2022-04-20

    Abstract: Method and corresponding device for plasma treating substrates (21) moving along a transport direction (5) through a treatment zone that is delimited in a direction transversal to said transport direction (5) by at least one wall (13) forming a diffuser panel presenting an aperture (23). The plasma is introduced into the treatment zone trough said aperture (23) and is generated by means of a plasma source connecting to the aperture (23). A multipolar cusp magnetic field is generated that extends along said wall (13) and at least partially around the aperture (23) and adjacent to this aperture (23) such that said plasma, entering the treatment zone trough said aperture (23), is distributed along said wall (13) in this treatment zone.

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