公开(公告)号：US4532152A

公开(公告)日：1985-07-30

申请号：US512461

申请日：1983-07-11

Applicant: Vito D. Elarde

Inventor： Vito D. Elarde

IPC: H05K3/04 ,  H05K3/06 ,  H05K3/10 ,  H05K3/14 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42 ,  B05D5/12

CPC classification number: H05K3/045 ,  H05K3/107 ,  H05K3/108 ,  H05K3/14 ,  H05K3/181 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/025 ,  H05K2203/1344 ,  H05K3/061 ,  H05K3/062 ,  H05K3/388 ,  H05K3/427 ,  Y10T29/49158 ,  Y10T29/4916

Abstract: A plastic substrate is injection molded to provide a pattern of channels in at least one of its sides to define a predetermined set of conductive paths. Both the surfaces of the channels and the non-channel surfaces therebetween are metalling through one or more steps of flame spraying, a combination of electroless plating and electroplating, gas plating or vacuum deposition. In one form of the invention the metallization over the non-channel surfaces is removed by abrading. In another form of the invention the initial metallization over the non-channel surfaces is coated with a resist prior to the deposition of another metal layer. The metal covering the channels is subsequently removed by stripping the resist and etching away the initial metallization.

Abstract translation: 注塑塑料基板以在其至少一个侧面提供通道图案，以限定一组预定的导电路径。 通道和非通道表面之间的两个表面均通过一个或多个火焰喷涂步骤，化学镀和电镀，气镀或真空沉积的组合进行金属化。 在本发明的一种形式中，非沟道表面上的金属化通过研磨去除。 在本发明的另一种形式中，非沟道表面上的初始金属化在另一金属层沉积之前被抗蚀剂涂覆。 随后通过剥离抗蚀剂去除覆盖通道的金属，并蚀刻掉初始金属化。

公开(公告)号：US4424408A

公开(公告)日：1984-01-03

申请号：US299345

申请日：1981-09-04

Applicant: Vito D. Elarde

Inventor： Vito D. Elarde

IPC: H05K1/09 ,  H05K3/06 ,  H05K3/14 ,  H05K3/24 ,  H05K3/38

CPC classification number: H05K3/24 ,  H05K1/09 ,  H05K3/14 ,  H05K2201/0338 ,  H05K2203/1344 ,  H05K3/06 ,  H05K3/143 ,  H05K3/388

Abstract: A high temperature circuit board made by flame spraying a high temperature resistant metal film, such as aluminum, zinc or silver solder braze alloy, onto a high temperature resistant insulative substrate in which in one embodiment a reverse circuit image resist is layed on the board surface and the metal is flame sprayed onto the board surface and the reverse image resist screen is then removed leaving the circuit without etching. In the other embodiment aluminum is flame sprayed onto the substrate and then a silver solder braze alloy or copper or nickel is flame sprayed onto the aluminum film, and then resist and etching stops are applied to remove unwanted metal to the substrate and the resist is stripped providing the high temperature printed circuit board.

Abstract translation: 通过将耐高温金属膜（例如铝，锌或银焊料钎焊合金）火焰喷涂到耐高温绝缘基板上制成的高温电路板，其中在一个实施例中将反向电路图像抗蚀剂铺设在板表面上 并且金属被火焰喷涂到板表面上，然后去除反向抗蚀剂屏幕，留下电路而没有蚀刻。 在另一实施例中，铝被火焰喷涂到基板上，然后将银焊料钎焊合金或铜或镍火焰喷涂到铝膜上，然后施加抗蚀和蚀刻停止以将不需要的金属去除到基板上，并且抗蚀剂被剥离 提供高温印刷电路板。

公开(公告)号：US4689103A

公开(公告)日：1987-08-25

申请号：US798871

申请日：1985-11-18

Applicant: Vito D. Elarde

Inventor： Vito D. Elarde

IPC: H05K3/00 ,  H05K3/10 ,  B29C45/03

CPC classification number: H05K3/107 ,  H05K3/0097 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/0165 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165

Abstract: A plurality of physically separate plastic substates are injection molded, each with at least one pattern of channels formed in a surface of thereof defining a conductive circuit to be formed. The plurality of substrates are then physically connected in a common planar array either by inserting them in corresponding receptacles in a carrier board, by mating peripheral connecting elements, by using adhesive or by some other suitable connecting mechanism. Where a carrier board with pre-formed receptacles is not utilized, the individual substrates in the array are pierced and replaced. The planar array is processed to simultaneously form a conductive circuit on each substrate consisting of metal deposited in its pattern of channels. The planar array of metallized substrates may then be stuffed with electronic components on an automatic insertion machine, wave soldered. The individual finished circuit boards are then pressed out. This batch processing results in substantial savings in handling costs and avoids the significant expense and tolerance problems associated with using very large molds which would be required to form the large planar array directly.

Abstract translation: 多个物理上分离的塑料子状态是注射成型的，每个具有形成在其表面中的限定要形成的导电电路的通道中的至少一个图案。 然后通过使用粘合剂或通过一些其它合适的连接机构将多个基板通过将它们插入到载体板中的相应的容器中，通过配合外围连接元件来物理地连接在共同的平面阵列中。 在没有使用带有预成型插座的承载板的情况下，阵列中的各个基板被穿孔并更换。 处理平面阵列以在由以其通道图案沉积的金属组成的每个基板上同时形成导电电路。 然后，金属化基板的平面阵列可以在自动插入机上填充电子部件，波形焊接。 然后将各个成品电路板压出。 这种批量处理可大大节省处理成本，并避免与使用直接形成大平面阵列所需的非常大的模具相关的显着的费用和公差问题。