SOLID-STATE BONDING METHOD FOR THE MANUFACTURE OF SEMICONDUCTOR CHUCKS AND HEATERS

    公开(公告)号:US20240404869A1

    公开(公告)日:2024-12-05

    申请号:US18804194

    申请日:2024-08-14

    Abstract: A layered assembly for use in a controlled atmosphere chamber includes a plurality of substrates and an electrically functioning layer embedded between two adjacent substrates of the plurality of substrates, the electrically functioning layer being a material configured to secure the two adjacent substrates together using a solid-state bonding process. An electrical termination area is integral with the electrically functioning layer, and a peripheral sealing band is embedded between and extends around a periphery of internal faces of the two adjacent substrates, the peripheral sealing band being a material configured to secure and seal the two adjacent substrates together using the solid-state bonding process. Dielectric regions are present between the two adjacent substrates and between edge boundaries of the electrically functioning layer, the dielectric regions being sealed between the two adjacent substrates by the peripheral sealing band.

    METAL HEATER ASSEMBLY WITH EMBEDDED RESISTIVE HEATERS

    公开(公告)号:US20220361296A1

    公开(公告)日:2022-11-10

    申请号:US17736185

    申请日:2022-05-04

    Abstract: A metal heater includes a metal substrate with a groove, a resistive heater disposed within the groove, and a fill metal disposed over the resistive heater and substantially filling the groove, wherein the fill metal has a lower melting temperature than the metal substrate. The fill metal can be indium and a cover plate can be bonded to the metal substrate and over the indium. A method of manufacturing the metal heater and a method of operating the metal heater are also provided.

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