公开(公告)号：US11845131B2

公开(公告)日：2023-12-19

申请号：US17860914

申请日：2022-07-08

Applicant: Sulzer Management AG

Inventor： Robin Rettberg ,  Bruno Maroccia

IPC: B23P15/00 ,  B23P15/04 ,  B22F5/00 ,  B23K9/04 ,  F01D5/04 ,  F04D29/22 ,  F04D29/28 ,  B23K9/173 ,  B23K26/342 ,  B23K10/02 ,  F04D29/02 ,  B23K9/167 ,  B33Y10/00 ,  B22F10/80 ,  B23P6/00 ,  F01D5/00 ,  B23K103/08 ,  B23K101/00 ,  B23K103/04 ,  B23K103/18 ,  B23K103/14 ,  B23K103/10 ,  B23K103/00 ,  B33Y80/00 ,  B22F10/28

CPC classification number: B22F5/009 ,  B22F10/80 ,  B23K9/044 ,  B23K9/167 ,  B23K9/173 ,  B23K10/027 ,  B23K26/342 ,  B23P6/007 ,  B23P15/006 ,  B23P15/04 ,  B33Y10/00 ,  F01D5/005 ,  F01D5/048 ,  F04D29/023 ,  F04D29/026 ,  F04D29/2222 ,  F04D29/284 ,  B22F10/28 ,  B23K2101/001 ,  B23K2103/04 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/14 ,  B23K2103/26 ,  B23K2103/42 ,  B23P2700/06 ,  B33Y80/00 ,  F05D2230/10 ,  F05D2230/31 ,  F05D2230/80

Abstract: A component of a rotary machine extends to an axial direction and a radial direction vertical thereto, and has an inner channel, extending from a first end of a core of a center of the component and to a second end at a radial limiting surface of the component and which is at least partially closed. A blank includes the core of the component and is limited by an outer surface in the radial direction. The blank is subtractively processed in a first subtractive process step, such that an outer contour is elaborated in the area of the outer surface, which extends in the radial direction, and a part of the channel is manufactured, which radially extends in the blank to the first end. The channel is formed by a build-up process on the blank.

公开(公告)号：US11833606B1

公开(公告)日：2023-12-05

申请号：US18127632

申请日：2023-03-28

Applicant: Peregrine Falcon Corporation

Inventor： Robert E. Hardesty

IPC: B23K20/00 ,  B23K20/02 ,  C22C27/02 ,  B23K103/08

CPC classification number: B23K20/023 ,  C22C27/02 ,  B23K2103/08

Abstract: A solid-state bonding method sandwiches an intermediate layer between a pair of refractory metal members, e.g., of niobium, tantalum, and alloys, to form a composite bonding assembly. This sandwiching can be repeated with multiple refractory metal members. The intermediate layer is substantially uniform of at most 75 μm thickness and composed of a material that is soluble and diffusive in the refractory metal members, e.g., of iron, nickel, cobalt, chromium, silicon, or carbon. Compressive pressure is applied, and the assembly is heated to a specified elevated temperature of at least 1280° C. The applied pressure and elevated temperature are maintained until the intermediate layer has dissolved surface oxides and asperities in the refractory metal members and has completely diffused into the refractory metal to create a seamless refractory metal bond. The pressures and temperatures needed are much lower than those required in direct diffusion bonding of refractory metals.

公开(公告)号：US11826822B2

公开(公告)日：2023-11-28

申请号：US17895290

申请日：2022-08-25

Applicant: Michael Thomas Stawovy

Inventor： Michael Thomas Stawovy

IPC: B33Y80/00 ,  B32B15/01 ,  C22C27/04 ,  B22D7/00 ,  B22F10/25 ,  B22F10/38 ,  B33Y10/00 ,  B33Y70/00 ,  B21C1/02 ,  B22F3/02 ,  B22F3/24 ,  B23K15/00 ,  F27D11/08 ,  B22F5/12 ,  B23K9/04 ,  B23K9/24 ,  B23K9/29 ,  B23K103/08 ,  B22F10/00 ,  B22F10/20

CPC classification number: B22D7/005 ,  B21C1/02 ,  B22F3/02 ,  B22F3/24 ,  B22F5/12 ,  B22F10/25 ,  B22F10/38 ,  B23K9/044 ,  B23K9/24 ,  B23K9/295 ,  B23K15/0086 ,  B23K15/0093 ,  B32B15/01 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C22C27/04 ,  F27D11/08 ,  B22F10/00 ,  B22F10/20 ,  B22F2301/20 ,  B23K2103/08 ,  Y02P10/25

Abstract: In various embodiments, three-dimensional layered metallic parts are substantially free of gaps between successive layers, are substantially free of cracks, and have densities no less than 97% of the theoretical density of the metallic material.

公开(公告)号：US20230321766A1

公开(公告)日：2023-10-12

申请号：US18329756

申请日：2023-06-06

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY

Inventor： Alfred Grant ELLIOT ,  Brent ELLIOT

IPC: B23K35/30 ,  B23K1/008 ,  B23K20/00 ,  B23K35/02 ,  B23K20/14 ,  B23K103/00 ,  B23K103/08

CPC classification number: B23K35/3033 ,  B23K1/008 ,  B23K20/008 ,  B23K35/0238 ,  B23K20/14 ,  B23K2103/52 ,  B23K2103/08

Abstract: A joining method includes the steps of placing a brazing element between an interface area of a first ceramic piece and an interface area of a second ceramic piece to create a joining pre-assembly, placing the components of said joining pre-assembly into a process chamber, removing oxygen from said process chamber, and heating at least said brazing element of said joining pre-assembly, thereby hermetically joining said first ceramic piece to said second ceramic piece. The brazing element consists of Nickel and Carbon.

公开(公告)号：US11759877B2

公开(公告)日：2023-09-19

申请号：US15389779

申请日：2016-12-23

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Raghavendra Rao Adharapurapu ,  Michael Francis Xavier Gigliotti, Jr. ,  David Edwin Budinger ,  Pazhayannur Ramanathan Subramanian ,  Jeffrey Jon Schoonover

IPC: C22C45/04 ,  B23K1/00 ,  B23K35/30 ,  F01D25/00 ,  F01D25/24 ,  F01D5/28 ,  F01D5/00 ,  B23K101/00 ,  B23K103/08

CPC classification number: B23K1/0018 ,  B23K35/3033 ,  C22C45/04 ,  F01D5/005 ,  F01D5/282 ,  F01D25/005 ,  F01D25/24 ,  B23K2101/001 ,  B23K2103/08 ,  F05D2230/237 ,  F05D2230/80 ,  F05D2300/175

Abstract: A nickel-based braze alloy composition includes nickel, about 1 weight % to about 5 weight % boron (B); and about 1 weight % to about 20 weight % germanium (Ge). The composition is free of any silicon. Superalloy articles having a crack or other type of void or gap may be filled with the nickel-based braze alloy composition. Methods for filling such a gap are described.

公开(公告)号：US11753704B2

公开(公告)日：2023-09-12

申请号：US17577573

申请日：2022-01-18

Applicant: Siemens Energy, Inc.

Inventor： Kazim Ozbaysal ,  Ahmed Kamel

IPC: C22C19/05 ,  B33Y70/00 ,  C22C1/04 ,  B23K35/02 ,  B23K35/30 ,  C22C30/00 ,  B33Y80/00 ,  B33Y40/20 ,  B22F10/62 ,  B22F10/64 ,  B22F12/41 ,  B22F1/105 ,  B22F5/04 ,  B23K26/342 ,  B29C64/165 ,  B22F10/14 ,  B22F10/25 ,  B22F1/00 ,  B33Y10/00 ,  B22F10/28 ,  B23K103/08 ,  B22F1/05

CPC classification number: C22C19/056 ,  B22F1/09 ,  B22F1/105 ,  B22F5/04 ,  B22F10/14 ,  B22F10/25 ,  B22F10/62 ,  B22F10/64 ,  B22F12/41 ,  B23K26/342 ,  B23K35/0261 ,  B23K35/304 ,  B29C64/165 ,  B33Y40/20 ,  B33Y70/00 ,  B33Y80/00 ,  C22C1/0433 ,  C22C19/057 ,  C22C30/00 ,  B22F1/05 ,  B22F10/28 ,  B22F2301/052 ,  B22F2301/15 ,  B22F2301/205 ,  B22F2304/10 ,  B22F2998/10 ,  B23K2103/08 ,  B33Y10/00 ,  C22C2202/00

Abstract: A low melt superalloy powder mixture is provided for use with additive manufacturing or welding metal components or portions thereof. The low melt superalloy powder may include by weight about 9.5% to about 10.5% chromium, about 2.9% to about 3.4% cobalt, about 8.0% to about 9.0% aluminum, about 3.8% to about 4.3% tungsten, about 0.8% to about 1.2% molybdenum, about 10% to about 20% tantalum, about 3% to about 12% hafnium, and at least 40% nickel.

公开(公告)号：US11682550B2

公开(公告)日：2023-06-20

申请号：US16787432

申请日：2020-02-11

Applicant: Tech Met, Inc.

Inventor： Michael Vidra ,  Robert Vaccaro ,  Edward Palanko ,  Mark Megela

IPC: H01S3/00 ,  H01L21/02 ,  G02B27/09 ,  H01S5/00 ,  G02B27/30 ,  B23K26/352 ,  B23K26/362 ,  B23K26/402 ,  B23H3/00 ,  B26D7/26 ,  B26D3/08 ,  C23F1/00 ,  C23F1/02 ,  C23F1/04 ,  B23K26/0622 ,  B23K26/10 ,  B23K26/40 ,  B23K26/08 ,  B23K26/046 ,  B23K26/00 ,  B23K26/361 ,  G02B26/10 ,  H01S5/062 ,  B23K103/16 ,  B23K101/12 ,  B23K103/00 ,  B23K103/08 ,  B23K101/06 ,  B23K103/02

CPC classification number: H01L21/02019 ,  B23H3/00 ,  B23K26/0006 ,  B23K26/046 ,  B23K26/0622 ,  B23K26/0823 ,  B23K26/0869 ,  B23K26/103 ,  B23K26/352 ,  B23K26/355 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K26/402 ,  B26D3/08 ,  B26D7/2614 ,  C23F1/00 ,  C23F1/02 ,  C23F1/04 ,  G02B26/10 ,  G02B27/0955 ,  G02B27/0977 ,  G02B27/30 ,  H01L21/02675 ,  H01S3/0071 ,  H01S5/0071 ,  H01S5/0085 ,  H01S5/06243 ,  B23K2101/06 ,  B23K2101/12 ,  B23K2103/02 ,  B23K2103/08 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54

Abstract: Systems and methods for etching complex patterns on an interior surface of a hollow object are disclosed. A method generally includes positioning a laser system within the hollow object with a focal point of the laser focused on the interior surface, and operating the laser system to form the complex pattern on the interior surface. Motion of the laser system and the hollow object is controlled by a motion control system configured to provide rotation and/or translation about a longitudinal axis of one or both of the hollow object and the laser system based on the complex pattern, and change a positional relationship between a reflector and a focusing lens of the laser system to accommodate a change in distance between the reflector and the interior surface of the hollow object.

公开(公告)号：US20190232426A1

公开(公告)日：2019-08-01

申请号：US15883720

申请日：2018-01-30

Applicant: Siemens Energy, Inc.

Inventor： Bernd Burbaum ,  Ahmed Kamel

IPC: B23K26/34 ,  B33Y10/00 ,  B33Y30/00 ,  B23K26/354

CPC classification number: B23K26/34 ,  B23K1/0018 ,  B23K26/0006 ,  B23K26/144 ,  B23K26/354 ,  B23K26/70 ,  B23K2101/001 ,  B23K2103/08 ,  B23P6/007 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  F01D5/005 ,  F05D2230/234 ,  F05D2230/30 ,  F05D2300/175

Abstract: Systems and methods for additively manufacturing or repairing a component from a base material. The system may include an inoculation source to direct inoculation materials and a laser metal deposition (LMD) system to direct laser energy during laser processing of additive materials deposited in a melt pool on the base material. The LMD system includes a laser energy source configured to direct laser energy towards the base material and inoculation materials to form the melt pool thereon and to process the deposited additive materials and inoculation materials to form layers on the base material upon solidification.

公开(公告)号：US20190151979A1

公开(公告)日：2019-05-23

申请号：US16098487

申请日：2017-05-03

Applicant: CORNING INCORPORATED

Inventor： Martin Herbert Goller ,  David Myron Lineman

IPC: B23K20/02 ,  B23K20/233

CPC classification number: B23K20/021 ,  B23K20/233 ,  B23K20/24 ,  B23K2101/04 ,  B23K2101/16 ,  B23K2103/08 ,  B23K2103/50

Abstract: A first method of forming an object (400) includes wrapping foil around a preform (305) to provide a multi-layered structure including a plurality of layers of wrapped foil, and diffusion bonding the plurality of layers and the preform (305) together to form the object (400). A second method of forming an object includes wrapping foil around a preform (305) to provide a multi-layered structure comprising a plurality of layers of wrapped foil, removing the preform (305) from the multi-layered structure, and diffusion bonding the plurality of layers together to form the object (400). A third method of forming an object includes stacking a plurality of layers of foil to provide a multi- layered structure, diffusion bonding the plurality of layers together, and shaping the diffusion bonded multi-layered structure to form the object (400).

公开(公告)号：US20180222748A1

公开(公告)日：2018-08-09

申请号：US15875943

申请日：2018-01-19

Applicant: Georgia Tech Research Corporation

Inventor： Benoit Hamelin ,  Farrokh Ayazi

IPC: B81C1/00 ,  B23K26/20

CPC classification number: B81C1/0065 ,  B23K26/0006 ,  B23K26/20 ,  B23K26/34 ,  B23K26/351 ,  B23K26/354 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/52 ,  B81B3/007 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81C2201/0166 ,  B81C2201/0167 ,  B81C2201/0169 ,  H01L41/253 ,  H03H3/013 ,  H03H3/04

Abstract: Embodiments of the present disclosure can include a method for frequency trimming a microelectromechanical resonator, the resonator comprising a substrate and a plurality of loading elements layered on a surface of the substrate, the method comprising: selecting a first loading element of the plurality of loading elements, the first loading element being layered on a surface of a region of interest of the substrate; heating the first loading element and substrate within the region of interest to a predetermined temperature using an optical energy source, causing the first loading element to diffuse into the substrate; and cooling the region of interest to form a eutectic composition layer bonding the loading element and the substrate within the region of interest.