公开(公告)号：US3713213A

公开(公告)日：1973-01-30

申请号：US3713213D

申请日：1971-11-26

Applicant: WESTERN ELECTRIC CO

Inventor： CRANSTON B

IPC: B23K20/08 ,  H01C17/07 ,  H01L21/607 ,  H01C7/00 ,  H01C17/00

CPC classification number: H01C17/07 ,  B23K20/08 ,  H01L24/80 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  Y10T29/49082 ,  Y10T29/49099 ,  H01L2924/00 ,  H01L2224/48

Abstract: First workpieces, for example, beam-leaded integrated circuits, and the like, are bonded to second workpieces, for example, metallized ceramic substrates by first depositing a quantity of primary explosive, such as lead azide, onto each beam lead and then detonating the explosive to explosively bond the integrated circuits to the substrate. In another embodiment of the invention, the explosive bonding force is applied through a buffer sheet of plastic or metallic material which protects the surface of the substrate from contamination and which, in addition, dampens the shock of the explosion. In yet another embodiment of the invention, metal conductive paths are explosively bonded directly to a ceramic or glass substrate to form a ''''printed circuit pattern.'''' The same techniques are used to manufacture resistors, capacitors, inductors, etc.

公开(公告)号：US3805120A

公开(公告)日：1974-04-16

申请号：US20256771

申请日：1971-11-26

Applicant: WESTERN ELECTRIC CO

Inventor： CRANSTON B

IPC: B23K20/08 ,  H01L21/60 ,  H01L21/607 ,  H01L49/02 ,  H01R12/00 ,  H01L1/14

CPC classification number: B23K20/085 ,  H01L24/80 ,  H01L49/02 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  Y10S228/903 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058

Abstract: An article of manufacture comprising a beam-leaded semiconductor device. Each beam lead has a quantity of explosive material deposited thereon to facilitate the subsequent explosive bonding of the device to a suitable substrate. The preferred explosive is lead azide and in some embodiments, the beam leads have an undulating or castellated surface to increase the adhesion of the explosive bond.

Abstract translation: 一种制造商，其包括一个束带半导体器件。 每个光束引线具有沉积在其上的一定数量的爆炸性材料，以便于随后的器件与合适的衬底的爆炸性接合。 优选的炸药是叠氮化铅，并且在一些实施例中，束引线具有起伏或雉形的表面以增加爆炸物接合的附着力。

公开(公告)号：US3736654A

公开(公告)日：1973-06-05

申请号：US3736654D

申请日：1971-11-26

Applicant: WESTERN ELECTRIC CO

Inventor： CRANSTON B

IPC: B23K20/08 ,  H01L21/00 ,  B23K21/00

CPC classification number: H01L21/67144 ,  B23K20/08 ,  H01L24/01 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00

Abstract: First workpieces, for example, beam-leaded integrated circuits, and the like, are bonded to second workpieces, for example, metallized ceramic substrates by first depositing a quantity of primary explosive, such as lead azide, onto each beam lead and then detonating the explosive to explosively bond the integrated circuits to the substrate. In another embodiment of the invention, the explosive bonding force is applied through a buffer sheet of plastic or metallic material which protects the surface of the substrate from contamination and which, in addition, dampens the shock of the explosion. In yet another embodiment of the invention, metal conductive paths are explosively bonded directly to a ceramic or glass substrate to form a ''''printed circuit pattern.'''' The same techniques are used to manufacture resistors, capacitors, inductors, etc.

公开(公告)号：US3739614A

公开(公告)日：1973-06-19

申请号：US3739614D

申请日：1971-11-26

Applicant: WESTERN ELECTRIC CO

Inventor： CRANSTON B

IPC: H01L21/00 ,  B21D26/02 ,  B21J5/04

CPC classification number: H01L21/67144 ,  H01L2924/19041 ,  Y10T29/49806

Abstract: First workpieces, for example, beam-leaded integrated circuits, and the like, are bonded to second workpieces, for example, metallized ceramic substrates by first depositing a quantity of primary explosive, such as lead azide, onto each beam lead and then detonating the explosive to explosively bond the integrated circuits to the substrate. In another embodiment of the invention, the explosive bonding force is applied through a buffer sheet of plastic or metallic material which protects the surface of the substrate from contamination and which, in addition, dampens the shock of the explosion. In yet another embodiment of the invention, metal conductive paths are explosively bonded directly to a ceramic or glass substrate to form a ''''printed circuit pattern.'''' The same techniques are used to manufacture resistors, capacitors, inductors, etc. In another embodiment in an explosive metal-working process the explosive charge is applied to the workpiece through apertures in a stencil or through windows of a silk-screen to form a plurality of discrete explosive charges.

Abstract translation: 第一工件，例如，光束引线集成电路等通过首先在每个光束引线上沉积一些初级炸药（例如叠氮化铅），然后引爆第二工件，例如金属化陶瓷衬底 将集成电路爆炸性地结合到基板上。 在本发明的另一个实施例中，爆炸结合力通过塑料或金属材料的缓冲片施加，其保护衬底的表面免受污染，并且还抑制爆炸的冲击。 在本发明的另一个实施例中，金属导电路径被直接爆炸地结合到陶瓷或玻璃基板上以形成“印刷电路图案”。 相同的技术用于制造电阻器，电容器，电感器等。在爆炸性金属加工过程的另一个实施例中，通过丝网中的孔或通过丝网的窗口将炸药施加到工件，以形成多个 的分立炸药。

公开(公告)号：US3737986A

公开(公告)日：1973-06-12

申请号：US3737986D

申请日：1971-11-26

Applicant: WESTERN ELECTRIC CO

Inventor： CRANSTON B

IPC: B23K20/08 ,  H01L21/00 ,  H01L21/607 ,  H05K1/03 ,  H05K3/20 ,  H05K3/32 ,  H05K3/38 ,  B01J17/00 ,  H01L7/02 ,  H01L7/16

CPC classification number: H01L21/67144 ,  B23K20/08 ,  H01L24/80 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/0306 ,  H05K3/202 ,  H05K3/328 ,  H05K3/38 ,  H05K2201/10628 ,  H05K2203/0271 ,  Y10T29/49121 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/48

Abstract: First workpieces, for example, beam-leaded integrated circuits, and the like, are bonded to second workpieces, for example, metallized ceramic substrates by first depositing a quantity of primary explosive, such as lead azide, onto each beam lead and then detonating the explosive to explosively bond the integrated circuits to the substrate. In another embodiment of the invention, the explosive bonding force is applied through a buffer sheet of plastic or metallic material which protects the surface of the substrate from contamination and which, in addition, dampens the shock of the explosion. In yet another embodiment of the invention, metal conductive paths are explosively bonded directly to a ceramic or glass substrate to form a ''''printed circuit pattern.'''' The same techniques are used to manufacture resistors, capacitors, inductors, etc.

公开(公告)号：US3733684A

公开(公告)日：1973-05-22

申请号：US20234971

申请日：1971-11-26

Applicant: WESTERN ELECTRIC CO

Inventor： CRANSTON B

IPC: B23K20/08 ,  H01L21/00 ,  H01L21/607 ,  B23K21/00

CPC classification number: H01L21/67144 ,  B23K20/08 ,  H01L24/80 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/48

Abstract: First workpieces, for example, beam-leaded integrated circuits, and the like, are bonded to second work-pieces, for example, metallized ceramic substrates by first depositing a quantity of primary explosive, such as lead azide, onto each beam lead and then detonating the explosive to explosively bond the integrated circuits to the substrate. In another embodiment of the invention, the explosive bonding force is applied through a buffer sheet of plastic or metallic material which protects the surface of the substrate from contamination and which, in addition, dampens the shock of the explosion. In yet another embodiment of the invention, metal conductive paths are explosively bonded directly to a ceramic or glass substrate to form a ''''printed circuit pattern.'''' The same techniques are used to manufacture resistors, capacitors, inductors, etc.

Abstract translation: 第一工件，例如，光束引线集成电路等通过首先在每个光束引线上沉积一些初级炸药（例如叠氮化铅）而结合到第二工件，例如金属化陶瓷衬底上，然后 引爆爆炸物将集成电路爆炸性地接合到基板上。 在本发明的另一个实施例中，爆炸结合力通过塑料或金属材料的缓冲片施加，其保护衬底的表面免受污染，并且还抑制爆炸的冲击。 在本发明的另一个实施例中，金属导电路径被直接爆炸地结合到陶瓷或玻璃基板上以形成“印刷电路图案”。 使用相同的技术来制造电阻器，电容器，电感器等

公开(公告)号：US3766635A

公开(公告)日：1973-10-23

申请号：US3766635D

申请日：1971-11-26

Applicant: WESTERN ELECTRIC CO

Inventor： CRANSTON B

IPC: B23K20/08 ,  H01L21/60 ,  H01L21/607 ,  H01L49/02 ,  B23K31/02

CPC classification number: H01L24/80 ,  B23K20/085 ,  H01L49/02 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/48

Abstract: First workpieces, for example, beam-leaded integrated circuits, and the like, are bonded to second workpieces, for example, metallized ceramic substrates by first depositing a quantity of primary explosive, such as lead azide, onto each beam lead and then detonating the explosive to explosively bond the integrated circuits to the substrate. In another embodiment of the invention, the explosive bonding force is applied through a buffer sheet of plastic or metallic material which protects the surface of the substrate from contamination and which, in addition, dampens the shock of the explosion. In yet another embodiment of the invention, metal conductive paths are explosively bonded directly to a ceramic or glass substrate to form a ''''printed circuit pattern.'''' The same techniques are used to manufacture resistors, capacitors, inductors, etc.

公开(公告)号：US3765845A

公开(公告)日：1973-10-16

申请号：US3765845D

申请日：1971-11-03

Applicant: WESTERN ELECTRIC CO

Inventor： CRANSTON B

IPC: H01L21/60 ,  H01L21/66 ,  B32B15/00

CPC classification number: H01L24/81 ,  H01L22/12 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/757 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10T428/12326 ,  Y10T428/12347 ,  Y10T428/12361 ,  Y10T428/12368 ,  H01L2924/00

Abstract: Bond strengths between bonded leads of electrical devices and conductive elements of circuit patterns are evaluated by preengaging a flexible member such as a wire or strip of metal with the electrical device prior to the making of the bond to be evaluated. The flexible member is engaged with the electrical device with a predetermined releasability so that, when the flexible member is pulled, the member releases from the device if the bonds are of satisfactory strength but the bonds rupture if they are of unsatisfactory strength and, in this instance, the flexible member remains intact. Particular utility resides in employing this system to evaluate bond strengths of leads of beam-lead integrated circuits or transistors when such devices are bonded to thin film circuits.

Abstract translation: 电气设备的接合引线和电路图案的导电元件之间的结合强度通过在制造要评估的接合点之前预先接合诸如金属线或金属带的金属线与电气设备的柔性构件来进行评估。 柔性构件以预定的释放性与电气装置接合，使得当柔性构件被拉动时，如果结合力具有令人满意的强度，则构件从构件释放，但是如果它们的强度不能令人满意，则该构件断裂，并且在该 例如，柔性部件保持原样。 特别的实用性在于，当这种装置结合到薄膜电路时，采用该系统评估束 - 铅集成电路或晶体管的引线的键强度。