公开(公告)号：US20240006403A1

公开(公告)日：2024-01-04

申请号：US18036904

申请日：2021-12-03

Applicant: Molex, LLC

Inventor： Victor Zaderej ,  Richard Fitzpatrick ,  Alan Han ,  Lily Yeung ,  Ronald C. Hodge ,  Gary Thomas O'Connor

IPC: H01L25/00 ,  H01L21/48 ,  H01L23/495 ,  H01L25/07 ,  H05K1/18 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L25/50 ,  H01L21/4842 ,  H01L23/49575 ,  H01L25/072 ,  H01L21/4846 ,  H01L23/49562 ,  H05K1/181 ,  H01L23/49861 ,  H05K3/32 ,  H05K3/3426 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10522 ,  H05K2201/10818 ,  H05K2201/10378 ,  H05K2201/10628

Abstract: A high-power electronics device and a method of forming same are disclosed. The high-power electronics device is formed of a plurality of layers including molding compound, a printed circuit board, electrically conductive contacts, at least one electronic component, and molding compound. In an embodiment, a layer of a dielectric carrier is also provided.

公开(公告)号：US09974182B2

公开(公告)日：2018-05-15

申请号：US15326870

申请日：2015-07-01

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd ,  Sumitomo Electric Industries, Ltd.

Inventor： Arinobu Nakamura

IPC: H05K7/10 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/115 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided is a circuit assembly that does not require e.g. bending of a terminal of an electronic component. A circuit assembly includes an electronic component that is to be mounted is connected to a conductive member through a first opening in a state in which its main body is disposed on one side of a substrate covering at least a part of the first opening formed in the substrate, and a first terminal is connected to a conductive pattern (a land) of the substrate, and a second terminal is connected to the conductive member through a second opening formed in the substrate.

公开(公告)号：US09705320B1

公开(公告)日：2017-07-11

申请号：US14041510

申请日：2013-09-30

Applicant: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administration

Inventor： David J. Petrick

IPC: H02J3/14 ,  H02J1/00 ,  H02H3/087

CPC classification number: G06F1/185 ,  G06F1/189 ,  H02H3/087 ,  H02J1/00 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4644 ,  H05K2201/09409 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10628 ,  Y02P70/611

Abstract: A low power voltage control circuit for use in space missions includes a switching device coupled between an input voltage and an output voltage. The switching device includes a control input coupled to an enable signal, wherein the control input is configured to selectively turn the output voltage on or off based at least in part on the enable signal. A current monitoring circuit is coupled to the output voltage and configured to produce a trip signal, wherein the trip signal is active when a load current flowing through the switching device is determined to exceed a predetermined threshold and is inactive otherwise. The power voltage control circuit is constructed of space qualified components.

公开(公告)号：US20160183369A1

公开(公告)日：2016-06-23

申请号：US14579902

申请日：2014-12-22

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H05K1/11 ,  H05K1/18 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

Abstract translation: 本公开的实施例涉及具有形成在引线的外表面中的凹部的引线框封装。 这些凹部填充有诸如焊料的填充材料。 凹槽中的填充材料提供用于填充材料（例如焊料）的可润湿表面，以在将包装安装到诸如印刷电路板（PCB）的另一装置时粘附。 这使得封装引线与PCB之间能够实现强焊点。 它还可以在安装包装后改善焊点的目视检查。

公开(公告)号：US20160029481A1

公开(公告)日：2016-01-28

申请号：US14809195

申请日：2015-07-25

Applicant: GrafTech International Holdings Inc.

Inventor： Alexander J. Augoustidis ,  Gregory P. Kramer ,  Robert Anderson Reynolds, III

IPC: H05K1/03 ,  F21V29/85 ,  H05K1/02 ,  F21V29/83 ,  H05B33/06 ,  H05B33/12 ,  F21V29/70

CPC classification number: F21K9/20 ,  F21V29/70 ,  F21V29/83 ,  F21V29/85 ,  H05B33/06 ,  H05B33/12 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/032 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/092 ,  H05K3/245 ,  H05K3/44 ,  H05K7/20127 ,  H05K7/20963 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/1056 ,  H05K2201/10628

Abstract: A display device is provided. The display device includes a light engine having light emitting components mounted to a flexible circuit board having a flexible graphite substrate. The flexible circuit board includes a dielectric layer formed on the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the light emitting components for improved cooling of the heat generated by the light emitting component and surrounding devices.

Abstract translation: 提供显示装置。 显示装置包括具有安装到具有柔性石墨基板的柔性电路板的发光部件的光引擎。 柔性电路板包括形成在柔性石墨基板的表面上的电介质层和形成在电介质表面上的导电层。 高的平面内导热石墨衬底提供增强的传热能力以有效地将热量从发光部件移开，以改善由发光部件和周围器件产生的热量的冷却。

公开(公告)号：US20160029480A1

公开(公告)日：2016-01-28

申请号：US14809193

申请日：2015-07-25

Applicant: GrafTech International Holdings Inc.

Inventor： Alexander J. Augoustidis ,  Gregory P. Kramer ,  Robert Anderson Reynolds, III

IPC: H05K1/03 ,  H05K1/09

CPC classification number: F21K9/20 ,  F21V29/70 ,  F21V29/83 ,  F21V29/85 ,  H05B33/06 ,  H05B33/12 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/032 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/092 ,  H05K3/245 ,  H05K3/44 ,  H05K7/20127 ,  H05K7/20963 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/1056 ,  H05K2201/10628

Abstract: A flexible circuit board having a flexible graphite substrate is provided. The flexible circuit board includes a dielectric layer formed on the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. Electronic components are mounted to the flexible circuit board to form a circuit arrangement. A thermally conductive conduit can be disposed in thermal and physical contact with a surface of the electronic component and the surface of the flexible graphite substrate to. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the electronic components for improved cooling of the heat generating electronic component and surrounding devices.

Abstract translation: 提供了具有柔性石墨基板的柔性电路板。 柔性电路板包括形成在柔性石墨基板的表面上的电介质层和形成在电介质表面上的导电层。 电子部件安装到柔性电路板上以形成电路装置。 导热导管可以与电子部件的表面和柔性石墨基板的表面热物理接触地布置。 高平面导热石墨基板提供增强的传热能力，以有效地将热量从电子部件移开，以改善发热电子部件和周围装置的冷却。

公开(公告)号：US20160025280A1

公开(公告)日：2016-01-28

申请号：US14809194

申请日：2015-07-25

Applicant: GrafTech International Holdings Inc.

Inventor： Alexander J. Augoustidis ,  Gregory P. Kramer ,  Robert Anderson Reynolds, III

IPC: F21K99/00 ,  H05K1/03 ,  H05K1/09 ,  F21V29/83

CPC classification number: F21K9/20 ,  F21V29/70 ,  F21V29/83 ,  F21V29/85 ,  H05B33/06 ,  H05B33/12 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/032 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/092 ,  H05K3/245 ,  H05K3/44 ,  H05K7/20127 ,  H05K7/20963 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/1056 ,  H05K2201/10628

Abstract: An LED light arrangement is provided. The light arrangement includes LED light emitting components mounted to a flexible circuit board having a flexible graphite substrate. The flexible circuit board includes a dielectric layer formed an the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the electronic components for improved cooling of the heat generating light emitting component and surrounding devices.

Abstract translation: 提供LED灯布置。 光装置包括安装在具有柔性石墨基板的柔性电路板上的LED发光部件。 柔性电路板包括形成在柔性石墨基板的表面上的电介质层和形成在电介质表面上的导电层。 高平面导热石墨基板提供增强的传热能力，以有效地将热量从电子部件移开，以改善发热元件和周围设备的冷却。

公开(公告)号：US20150043181A1

公开(公告)日：2015-02-12

申请号：US14523245

申请日：2014-10-24

Applicant: TESSERA, INC.

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2924/206

Abstract: The present disclosure is directed to a microelectronic assembly that includes first and second microelectronic elements, signal leads, one or more jumper leads, and a dielectric element that has first and second apertures. The signal leads may be connected to one or more of the microelectronic elements and extend through the one or more of the first or second apertures to conductive elements on the dielectric element. The jumper leads may extend through the first aperture and be connected to a contact of the first microelectronic element. The one or more jumper leads may span over the second aperture and be connected to a conductive element on the dielectric element.

Abstract translation: 本公开涉及包括第一和第二微电子元件，信号引线，一个或多个跳线以及具有第一和第二孔的电介质元件的微电子组件。 信号引线可以连接到一个或多个微电子元件，并且延伸通过第一或第二孔中的一个或多个到电介质元件上的导电元件。 跳线可以延伸穿过第一孔径并连接到第一微电子元件的触点。 一个或多个跨接线可以跨过第二孔并且连接到电介质元件上的导电元件。

公开(公告)号：US08722422B2

公开(公告)日：2014-05-13

申请号：US13415291

申请日：2012-03-08

Applicant: Dennis A. Briggs

Inventor： Dennis A. Briggs

IPC: B01L99/00 ,  F04B13/00 ,  F04B43/00

CPC classification number: H05K3/321 ,  F17D3/00 ,  H01L21/4867 ,  H01L23/498 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/225 ,  H05K3/3463 ,  H05K2201/0257 ,  H05K2201/0373 ,  H05K2201/10628 ,  H05K2203/176 ,  Y10T137/0396 ,  Y10T436/25 ,  Y10T436/2575 ,  H01L2924/00

Abstract: This invention describes a method for pumping or delivering fluids utilizing a flexible vessel subject to controlled pressures within another pressure vessel. The pressure vessel can be sourced with positive and/or negative (e.g., vacuum) pressure.

Abstract translation: 本发明描述了一种利用在另一个压力容器内承受受控压力的柔性容器泵送或输送流体的方法。 压力容器可以采用正和/或负（例如，真空）压力。

公开(公告)号：US08466564B2

公开(公告)日：2013-06-18

申请号：US13278506

申请日：2011-10-21

Applicant: Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H01L23/48 ,  H01L29/40

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element having at least one aperture and electrically conductive elements thereon including terminals exposed at the second surface of the dielectric element; a first microelectronic element having a rear surface and a front surface facing the dielectric element, the first microelectronic element having a plurality of contacts exposed at the front surface thereof; a second microelectronic element having a rear surface and a front surface facing the rear surface of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element; and an electrically conductive plane attached to the dielectric element and at least partially positioned between the first and second apertures, the electrically conductive plane being electrically connected with one or more of the contacts of at least one of the first or second microelectronic elements.

Abstract translation: 微电子组件包括具有至少一个孔的电介质元件和其上的导电元件，其中包括在电介质元件的第二表面处暴露的端子; 第一微电子元件，其具有后表面和面向介电元件的前表面，所述第一微电子元件具有在其前表面处暴露的多个触点; 第二微电子元件，其具有背表面和面向第一微电子元件的后表面的前表面，第二微电子元件具有暴露在前表面处并突出超过第一微电子元件的边缘的多个触点; 以及连接到电介质元件并且至少部分地定位在第一和第二孔之间的导电平面，导电平面与第一或第二微电子元件中的至少一个的一个或多个触点电连接。