公开(公告)号：US3895158A

公开(公告)日：1975-07-15

申请号：US38853373

申请日：1973-08-15

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： GAUSE SMITH A ,  GRAY JR MARION C ,  THOMAS WILBUR R

IPC: B32B5/28 ,  B29C70/00 ,  B32B17/04 ,  C08J5/24 ,  H05K1/03 ,  B32B5/08 ,  B32B5/12 ,  H05K1/00

CPC classification number: B32B29/02 ,  B29C70/00 ,  B29K2309/08 ,  B32B5/024 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B29/06 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/188 ,  B32B2307/202 ,  B32B2311/12 ,  B32B2311/30 ,  B32B2457/08 ,  C08J5/24 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S273/03 ,  Y10S273/07 ,  Y10T442/3634

Abstract: Unclad and metal clad laminates are constructed by sandwiching a resin impregnated core of paper between epoxy resin impregnated woven glass fabric sheets. The paper is a water laid sheet of cellulose fibers, preferably wood cellulose or cotton linter fibers having an average length from about 0.5 to 5 mm. The laminates are used as substrates for printed circuits and printed circuit modules.

Abstract translation: 通过将环氧树脂浸渍的玻璃织物片材之间的树脂浸渍的芯片夹在中间而构成未包层和金属覆层压板。 该纸是纤维素纤维的水性片材，优选平均长度为约0.5至5mm的木纤维素或棉绒纤维。 层压板用作印刷电路和印刷电路模块的基板。

公开(公告)号：US3644166A

公开(公告)日：1972-02-22

申请号：US3644166D

申请日：1968-03-28

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： GAUSE SMITH A

IPC: C09D183/08 ,  H05K1/03 ,  H05K3/38 ,  H05K1/00 ,  B32B15/08

CPC classification number: C09D183/08 ,  H05K1/0326 ,  H05K3/382 ,  H05K3/389 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2203/0315 ,  Y10S273/29 ,  Y10T428/265 ,  Y10T428/31663 ,  Y10T442/138 ,  Y10T442/14 ,  Y10T442/191

Abstract: A copper-clad laminate is made with a copper foil, an intermediate thin film of an amino-silane applied over the copper surface and layers of a resin impregnated support material. The amino-silane film uniformly covers the copper surface and prevents oxide transfer to the support material.