公开(公告)号：US3683492A

公开(公告)日：1972-08-15

申请号：US3683492D

申请日：1970-02-06

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： MEYERHOFF ALFRED ,  BLAKE WALTER E

IPC: H01L21/60 ,  H01L23/16 ,  B01J17/00 ,  H01L1/10

CPC classification number: H01L23/16 ,  H01L24/90 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/1301 ,  Y10T29/49918 ,  Y10T29/5327 ,  Y10T29/53274 ,  H01L2924/00

Abstract: Protrusions formed in a case member of a compression bonded encapsulated electrical device act on a resilient member and accurately maintain the compression force acting on the electrical contacts and the semiconductor element of the device.

Abstract translation: 形成在压接结合的密封电气装置的壳体构件中的突起作用在弹性构件上并且精确地保持作用在装置的电触点和半导体元件上的压缩力。

公开(公告)号：US3492545A

公开(公告)日：1970-01-27

申请号：US3492545D

申请日：1968-03-18

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： MEYERHOFF ALFRED

IPC: H01L21/60 ,  H01L23/48 ,  H01L5/00 ,  B23K31/02 ,  H01L7/32

CPC classification number: H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3011 ,  Y10S428/926 ,  Y10T29/49169 ,  Y10T428/12438 ,  Y10T428/12528 ,  Y10T428/12701 ,  Y10T428/12868 ,  Y10T428/12896

公开(公告)号：US3457988A

公开(公告)日：1969-07-29

申请号：US3457988D

申请日：1967-05-15

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： MEYERHOFF ALFRED ,  STEWART WILLIAM A ,  LONG ARTHUR H ,  KOTHMANN RICHARD E

IPC: H01L23/367 ,  H01L23/488 ,  F28F7/00

CPC classification number: H01L23/3672 ,  H01L23/488 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

公开(公告)号：US3619473A

公开(公告)日：1971-11-09

申请号：US3619473D

申请日：1969-11-19

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： MEYERHOFF ALFRED ,  GUZANICK PETER M ,  BLAKE WALTER E

IPC: H01L23/40 ,  H01L23/48 ,  H01L1/12

CPC classification number: H01L23/4006 ,  H01L24/72 ,  H01L2023/4025 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033

Abstract: The invention relates to a mounting bracket and to an assembly for a flat-packaged semiconductor device. The primary purpose of the bracket and assembly is to apply the contacting force to a semiconductor device without distorting or bending the contacting surfaces. The mounting bracket has two spaced-apart bosses which project into apertures of each member. The boss prevents electrical short circuiting from occurring between fasteners, required to clamp the components together, and the members. The bracket has a pressure contact which may be integral with, or separate from, the assembly. The pressure contact may have either a concave flexible face or a flat face for distributing the force of the bracket to a surface of member that it is mounted on.

公开(公告)号：US3513361A

公开(公告)日：1970-05-19

申请号：US3513361D

申请日：1968-05-09

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： MEYERHOFF ALFRED ,  GUZANICK PETER M

IPC: H01L23/488 ,  H01L1/06

CPC classification number: H01L23/488 ,  H01L24/01 ,  H01L2924/1301 ,  H01L2924/351 ,  Y10S257/926 ,  H01L2924/00