公开(公告)号：US09431774B2

公开(公告)日：2016-08-30

申请号：US13726528

申请日：2012-12-24

Applicant: Wistron Corporation

Inventor： Chia-Cheng Shih ,  Kuo-Pao Sun

IPC: H01R13/66 ,  H05K5/00 ,  G06F1/16 ,  H01R24/60 ,  H01R13/639

CPC classification number: H01R13/6658 ,  G06F1/1656 ,  H01R13/639 ,  H01R24/60 ,  H01R2201/06 ,  H05K5/0069

Abstract: A USB socket is disposed on a casing for connecting to a USB plug. The USB socket includes a piercing structure, a substrate and a plurality of terminals. The piercing structure is formed on a surface of the casing, and a main board is disposed inside the casing. An internal wall of the piercing structure can buckle the USB plug when the USB plug inserts into the piercing structure. The substrate is disposed on the main board and located inside the piercing structure. An integrated circuit is disposed on the substrate. The plurality of terminals is disposed on the substrate and coupled to the integrated circuit. The USB plug is electrically connected to the substrate and the terminals when the USB plug inserts into the piercing structure.

Abstract translation: USB插座设置在外壳上，用于连接到USB插头。 USB插座包括穿孔结构，基板和多个端子。 穿孔结构形成在壳体的表面上，并且主板设置在壳体内部。 当USB插头插入穿孔结构时，穿孔结构的内壁可以扣住USB插头。 基板设置在主板上并位于穿孔结构内部。 集成电路设置在基板上。 多个端子设置在基板上并耦合到集成电路。 当USB插头插入穿孔结构时，USB插头电连接到基板和端子。

公开(公告)号：US20140078695A1

公开(公告)日：2014-03-20

申请号：US13726528

申请日：2012-12-24

Applicant: WISTRON CORPORATION

Inventor： Chia-Cheng Shih ,  Kuo-Pao Sun

IPC: H01R13/66 ,  H05K5/00

CPC classification number: H01R13/6658 ,  G06F1/1656 ,  H01R13/639 ,  H01R24/60 ,  H01R2201/06 ,  H05K5/0069

Abstract: A USB socket is disposed on a casing for connecting to a USB plug. The USB socket includes a piercing structure, a substrate and a plurality of terminals. The piercing structure is formed on a surface of the casing, and a main board is disposed inside the casing. An internal wall of the piercing structure can buckle the USB plug when the USB plug inserts into the piercing structure. The substrate is disposed on the main board and located inside the piercing structure. An integrated circuit is disposed on the substrate. The plurality of terminals is disposed on the substrate and coupled to the integrated circuit. The USB plug is electrically connected to the substrate and the terminals when the USB plug inserts into the piercing structure.

Abstract translation: USB插座设置在外壳上，用于连接到USB插头。 USB插座包括穿孔结构，基板和多个端子。 穿孔结构形成在壳体的表面上，并且主板设置在壳体内部。 当USB插头插入穿孔结构时，穿孔结构的内壁可以扣住USB插头。 基板设置在主板上并位于穿孔结构内部。 集成电路设置在基板上。 多个端子设置在基板上并耦合到集成电路。 当USB插头插入穿孔结构时，USB插头电连接到基板和端子。