公开(公告)号：US20240213184A1

公开(公告)日：2024-06-27

申请号：US18145961

申请日：2022-12-23

Applicant: WOLFSPEED, INC.

Inventor： Haedong JANG ,  Mehdi HASAN ,  Marvin MARBELL ,  Jeremy FISHER

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/00 ,  H01L23/053 ,  H01L23/367 ,  H01L25/16

CPC classification number: H01L23/66 ,  H01L21/4817 ,  H01L23/053 ,  H01L23/367 ,  H01L24/48 ,  H01L25/165 ,  H01L2223/6672 ,  H01L2224/48175 ,  H01L2924/1033 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/13064 ,  H01L2924/1421

Abstract: A transistor device includes a metal submount; a transistor die arranged on said metal submount; an IPD component arranged on said metal submount, and the IPD component having a baseband damping resistor arranged on a thermally conductive dielectric substrate; and a second IPD component arranged on said metal submount, and the second IPD component may include a baseband decoupling capacitor arranged on a thermally conductive dielectric substrate.