公开(公告)号：US20240304515A1

公开(公告)日：2024-09-12

申请号：US18357211

申请日：2023-07-24

Applicant: Western Digital Technologies, Inc.

Inventor： Xuyi Yang ,  Yiqin Huang ,  Zengyu Zhou ,  Kandy Sun ,  Jerry Tang ,  Gang Liu ,  Cong Zhang ,  Hope Chiu

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/3735 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/50 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/73204 ,  H01L2225/065 ,  H01L2924/1438 ,  H10B80/00

Abstract: A semiconductor package having various thermal dissipation features to dissipate heat. The semiconductor package may include an integrated circuit and a non-volatile storage device. Vias may be formed in the substrate and filled with a thermal conductive material. A pyrolytic graphite sheet overlays a top surface of the substrate and the vias. The pyrolytic graphite sheet defines one or more openings that enable the integrated circuit and the non-volatile storage device to be coupled to the top surface of the substrate. The integrated circuit is covered by another thermal conductive material such as a copper or silver paste. The copper or silver paste also covers a sidewall of the pyrolytic graphite sheet. The semiconductor package is enclosed by molding material and a metal layer. The pyrolytic graphite sheet connects the metal layer and the thermal conductive material overlaying the integrated circuit to form various thermal dissipation paths.