公开(公告)号：US20170293226A1

公开(公告)日：2017-10-12

申请号：US15296335

申请日：2016-10-18

Applicant: Winbond Electronics Corp.

Inventor： Yu-Hsuan HO

IPC: G03F7/20

CPC classification number: G03F7/2035 ,  G03F7/2022 ,  G03F7/2051 ,  G03F7/2053 ,  G03F7/70383 ,  G03F7/70416

Abstract: An exposure method is provided. The exposure method includes coating a photo-curable material on a substrate, and exposing a portion of the photo-curable material by providing a first light source through an optical fiber to form a first photo-cured material. The optical fiber includes a light output end and a cone portion that tapers toward the light output end. The photo-curable material not exposed by the first light source is removed while leaving the first photo-cured material. Exposure equipment for performing the exposure method and a 3-dimensional structure formed thereby are also described.

公开(公告)号：US20170271173A1

公开(公告)日：2017-09-21

申请号：US15259504

申请日：2016-09-08

Applicant: Winbond Electronics Corp.

Inventor： Yu-Hsuan HO

IPC: H01L21/48 ,  B22F7/00 ,  C23C8/12 ,  B33Y10/00 ,  B33Y80/00 ,  C23C8/14 ,  B22F3/105 ,  B22F7/04

CPC classification number: H01L21/4857 ,  B22F3/1055 ,  B22F7/008 ,  B22F7/04 ,  B22F7/08 ,  B22F2007/042 ,  B22F2201/03 ,  B22F2201/10 ,  B22F2201/20 ,  B22F2301/052 ,  B22F2301/10 ,  B22F2301/20 ,  B22F2301/205 ,  B22F2301/35 ,  B22F2302/45 ,  B22F2998/10 ,  B22F2999/00 ,  B33Y10/00 ,  B33Y80/00 ,  C23C8/02 ,  C23C8/12 ,  C23C8/14 ,  H01L21/4803 ,  H01L23/49822 ,  Y02P10/295

Abstract: A method for forming a metallization structure is provided, including forming a metallic powder layer on a substrate; performing a first laser sintering on a first portion of the metallic powder layer to form a metal layer; and in the presence of oxygen, performing a second laser sintering on a second portion of the metallic powder layer to form a metal oxide layer to serve as a first dielectric layer.