Stress control of semiconductor microstructures for thin film growth
    1.
    发明申请
    Stress control of semiconductor microstructures for thin film growth 有权
    用于薄膜生长的半导体微结构的应力控制

    公开(公告)号:US20040232504A1

    公开(公告)日:2004-11-25

    申请号:US10876140

    申请日:2004-06-24

    Abstract: A suspended semiconductor film is anchored to a substrate at at least two opposed anchor positions, and film segments are deposited on the semiconductor film adjacent to one or more of the anchor positions to apply either tensile or compressive stress to the semiconductor film between the film segments. A crystalline silicon film may be anchored to the substrate and have tensile stress applied thereto to reduce the lattice mismatch between the silicon and a silicon-germanium layer deposited onto the silicon film. By controlling the level of stress in the silicon film, the size, density and distribution of quantum dots formed in a high germanium content silicon-germanium film deposited on the silicon film can be controlled.

    Abstract translation: 悬浮的半导体膜在至少两个相对的锚固位置处锚定到基底,并且膜部分沉积在与一个或多个锚定位置相邻的半导体膜上,以将拉伸或压缩应力施加到膜段之间的半导体膜 。 结晶硅膜可以锚定到基底并且施加拉伸应力以减小硅和沉积在硅膜上的硅 - 锗层之间的晶格失配。 通过控制硅膜中的应力水平,可以控制沉积在硅膜上的高锗含量硅 - 锗膜中形成的量子点的尺寸,密度和分布。

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