公开(公告)号：US10383254B2

公开(公告)日：2019-08-13

申请号：US15855545

申请日：2017-12-27

Applicant: Wistron NeWeb Corp.

Inventor： Hung-Ming Chang ,  Yi-Yun Chang ,  Shih-Hong Chen ,  Babak Radi ,  Sheng-Hung Tsai

IPC: F28D7/00 ,  H05K7/20 ,  G06F1/20 ,  H01L23/367 ,  H01L23/373

Abstract: An electronic device is provided. The electronic device includes a heat source, a heat-conductive member and a heat-dissipating sheet. The heat-conductive member includes a recess, wherein the recess is thermally connected to the heat source. The heat-dissipating sheet is attached to the heat-conductive member, wherein the heat-dissipating sheet covers the recess.