公开(公告)号：US20200335381A1

公开(公告)日：2020-10-22

申请号：US16921556

申请日：2020-07-06

Applicant: X Display Company Technology Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Salvatore Bonafede ,  Brook Raymond ,  Carl Ray Prevatte, JR.

IPC: H01L21/683 ,  B41F16/00 ,  H01L21/67 ,  H01L33/00

Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

公开(公告)号：US20220368306A1

公开(公告)日：2022-11-17

申请号：US17317408

申请日：2021-05-11

Applicant: X Display Company Technology Limited

Inventor： Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Salvatore Bonafede ,  Carl Ray Prevatte, JR. ,  Ronald S. Cok ,  Brook Raymond

IPC: H03H9/05 ,  H03H3/02 ,  H03H9/10 ,  B41F16/00

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.