公开(公告)号：US11387153B2

公开(公告)日：2022-07-12

申请号：US17011796

申请日：2020-09-03

Applicant: X Display Company Technology Limited

Inventor： Ronald S. Cok ,  Erich Radauscher ,  Salvatore Bonafede ,  Christopher Andrew Bower ,  Matthew Alexander Meitl ,  Carl Ray Prevatte, Jr. ,  Brook Raymond

IPC: H01L21/66 ,  H01L33/62 ,  H01L33/38 ,  H01L23/00 ,  H01L25/075 ,  H01L33/00

Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.

公开(公告)号：US12074583B2

公开(公告)日：2024-08-27

申请号：US17317408

申请日：2021-05-11

Applicant: X Display Company Technology Limited

Inventor： Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Salvatore Bonafede ,  Carl Ray Prevatte, Jr. ,  Ronald S. Cok ,  Brook Raymond

IPC: H03H9/05 ,  B41F16/00 ,  H03H3/02 ,  H03H9/10

CPC classification number: H03H9/0509 ,  B41F16/00 ,  H03H3/02 ,  H03H9/105

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

公开(公告)号：US11024608B2

公开(公告)日：2021-06-01

申请号：US16039191

申请日：2018-07-18

Applicant: X Display Company Technology Limited

Inventor： Matthew Meitl ,  Brook Raymond ,  Ronald S. Cok ,  Christopher Andrew Bower ,  Salvatore Bonafede ,  Erich Radauscher ,  Carl Ray Prevatte, Jr. ,  António José Marques Trindade ,  Tanya Yvette Moore

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/62 ,  H01L21/683 ,  H01L25/00 ,  H01L25/04 ,  H01L25/07

Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.

公开(公告)号：US10832935B2

公开(公告)日：2020-11-10

申请号：US16058097

申请日：2018-08-08

Applicant: X Display Company Technology Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Salvatore Bonafede ,  Brook Raymond ,  Carl Ray Prevatte, Jr.

IPC: H01L29/18 ,  H01L21/683 ,  B41F16/00 ,  H01L21/67 ,  H01L33/00 ,  H01L27/15

Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

公开(公告)号：US12249532B2

公开(公告)日：2025-03-11

申请号：US18140427

申请日：2023-04-27

Applicant: X Display Company Technology Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Salvatore Bonafede ,  Brook Raymond ,  Carl Ray Prevatte, Jr.

IPC: H01L21/683 ,  B41F16/00 ,  H01L21/67 ,  H01L33/00 ,  H01L27/15

Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

公开(公告)号：US20250046751A1

公开(公告)日：2025-02-06

申请号：US18362918

申请日：2023-07-31

Applicant: X Display Company Technology Limited

Inventor： Salvatore Bonafede ,  Carl Ray Prevatte, Jr. ,  Christopher Andrew Bower ,  Brook Raymond ,  Matthew Alexander Meitl ,  Ronald S. Cok ,  Andrew Tyler Pearson

IPC: H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L25/16

Abstract: Methods of making a printed structure include providing a target substrate, coating the target substrate with an uncured adhesive, disposing a component on the uncured adhesive, processing the uncured adhesive with or without a pattern, and curing the uncured adhesive. Some embodiments include having a target-substrate contact pad on the target substrate, disposing a post component on the uncured adhesive over the target-substrate contact pad, the post component having an electrical connection extending from the post component toward the target-substrate contact pad, disposing a non-post component on the uncured adhesive laterally displaced from the post component, pattern-wise processing the uncured adhesive so that a first portion of the uncured adhesive adjacent to the post component is not processed and a second portion of the uncured adhesive adjacent to the non-post component is processed, reflowing the unprocessed first portion of the uncured adhesive, and curing the uncured adhesive.

公开(公告)号：US20230343630A1

公开(公告)日：2023-10-26

申请号：US18140427

申请日：2023-04-27

Applicant: X Display Company Technology Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Salvatore Bonafede ,  Brook Raymond ,  Carl Ray Prevatte, Jr.

IPC: H01L21/683 ,  H01L33/00 ,  H01L21/67 ,  B41F16/00

CPC classification number: H01L21/6835 ,  B41F16/00 ,  H01L21/67144 ,  H01L33/0093 ,  H01L33/0095 ,  H01L27/15 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381

Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

公开(公告)号：US11670533B2

公开(公告)日：2023-06-06

申请号：US16921556

申请日：2020-07-06

Applicant: X Display Company Technology Limited

Inventor： Christopher Andrew Bower ,  Matthew Meitl ,  Salvatore Bonafede ,  Brook Raymond ,  Carl Ray Prevatte, Jr.

IPC: H01L29/18 ,  H01L21/683 ,  B41F16/00 ,  H01L21/67 ,  H01L33/00 ,  H01L27/15

CPC classification number: H01L21/6835 ,  B41F16/00 ,  H01L21/67144 ,  H01L33/0093 ,  H01L33/0095 ,  H01L27/15 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381

Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

公开(公告)号：US10796971B2

公开(公告)日：2020-10-06

申请号：US16101735

申请日：2018-08-13

Applicant: X Display Company Technology Limited

Inventor： Ronald S. Cok ,  Erich Radauscher ,  Salvatore Bonafede ,  Christopher Andrew Bower ,  Matthew Alexander Meitl ,  Carl Ray Prevatte, Jr. ,  Brook Raymond

IPC: H01L33/00 ,  H01L21/66 ,  H01L33/62 ,  H01L33/38 ,  H01L25/075

Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.

公开(公告)号：US10749093B2

公开(公告)日：2020-08-18

申请号：US16660776

申请日：2019-10-22

Applicant: X Display Company Technology Limited

Inventor： Matthew Meitl ,  Tanya Yvette Moore ,  Ronald S. Cok ,  Salvatore Bonafede ,  Brook Raymond ,  Christopher Andrew Bower ,  Carl Ray Prevatte, Jr.

IPC: H01L23/00 ,  H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L41/047 ,  H01L41/083 ,  H01L25/065 ,  H01L23/538

Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.