公开(公告)号：US11854855B2

公开(公告)日：2023-12-26

申请号：US16919072

申请日：2020-07-01

Applicant: X Display Company Technology Limited

Inventor： Erich Radauscher ,  Ronald S. Cok ,  Christopher Andrew Bower ,  Matthew Alexander Meitl ,  James O. Thostenson

IPC: H01L21/78 ,  H01L21/30 ,  H01L21/683 ,  H01L21/56 ,  H01L21/306 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L25/075 ,  G03F7/00 ,  H05K1/11 ,  B29C59/02

CPC classification number: H01L21/6835 ,  B29C59/026 ,  G03F7/0002 ,  H01L21/306 ,  H01L21/568 ,  H01L21/7806 ,  H01L23/3171 ,  H01L24/24 ,  H01L24/29 ,  H01L24/75 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/50 ,  H05K1/111 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/95001 ,  H01L2224/951 ,  H01L2224/95136 ,  H01L2924/1815

Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.

公开(公告)号：US10796938B2

公开(公告)日：2020-10-06

申请号：US16723942

申请日：2019-12-20

Applicant: X Display Company Technology Limited

Inventor： Erich Radauscher ,  Ronald S. Cok ,  Christopher Andrew Bower ,  Matthew Alexander Meitl ,  James O. Thostenson

IPC: H01L21/68 ,  H01L21/78 ,  H01L21/683 ,  H01L21/56 ,  H01L21/306 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L25/075 ,  G03F7/00 ,  H05K1/11 ,  B29C59/02

Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.

公开(公告)号：US20200335380A1

公开(公告)日：2020-10-22

申请号：US16919072

申请日：2020-07-01

Applicant: X Display Company Technology Limited

Inventor： Erich Radauscher ,  Ronald S. Cok ,  Christopher Andrew Bower ,  Matthew Alexander Meitl ,  James O. Thostenson

IPC: H01L21/683 ,  H01L21/78 ,  H01L21/56 ,  H01L21/306 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L25/075 ,  G03F7/00 ,  H05K1/11 ,  B29C59/02

Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.