公开(公告)号：US07480153B2

公开(公告)日：2009-01-20

申请号：US11322870

申请日：2005-12-30

Applicant: Xiao-Hua Kong

Inventor： Xiao-Hua Kong

IPC: H05K9/00

CPC classification number: H05K9/0026 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/16151 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0969 ,  H05K2201/10371 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An exemplary Electromagnetic Interference (EMI) shielding package (1) includes a substrate (10), a metal cap (15), and a potting compound (18). The substrate has a plurality of electronic components (11a, 11b, 12) fixed thereon. The metal cap includes a horizontal base panel (152) and a plurality of peripheral walls (151) vertical to the base panel. A related method for making the EMI shielding package includes: providing a substrate with a plurality of electronic components fixed thereon; providing a metal cap including a horizontal base panel and a plurality of peripheral walls vertical to the base panel; attaching the walls to the substrate, thereby covering selected one or more of the electronic components that need to be shielded with the metal cap; sealing the electronic components and the metal cap with a potting compound; and curing the potting compound to form an encapsulation.

Abstract translation: 示例性电磁干扰（EMI）屏蔽封装（1）包括衬底（10），金属帽（15）和灌封化合物（18）。 基板具有固定在其上的多个电子部件（11a，11b，12）。 金属盖包括垂直于基板的水平基板（152）和多个周壁（151）。 制造EMI屏蔽封装的相关方法包括：提供固定有多个电子部件的基板; 提供包括水平基板和垂直于所述基板的多个周壁的金属盖; 将壁附接到基板，从而覆盖需要被金属盖屏蔽的所选择的一个或多个电子部件; 用灌封胶密封电子元件和金属盖; 并固化灌封化合物以形成封装。

公开(公告)号：US20060223228A1

公开(公告)日：2006-10-05

申请号：US11323269

申请日：2005-12-30

Applicant: Xiao-Hua Kong

Inventor： Xiao-Hua Kong

IPC: H01L21/00

CPC classification number: H01L21/67132 ,  H01L21/786 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09918 ,  H05K2203/1383 ,  H05K2203/302 ,  Y10T29/49135

Abstract: A ceramic substrate (100) includes a top surface, a plurality of identification marks (104), a protective compound (110), a bottom surface, and a plurality of grooves (106). The top surface includes a first area and a second area. The first area is defined at one or more edges portions of the top surface. The second area is defined inside the first area. The identification marks are arranged on the first area. The protective compound is covered on the second area. The grooves are defined at the bottom surface, and corresponding to the identification marks. A related method for breaking a ceramic substrate includes: (a) pasting one or more tapes on the first area; (b) covering protective compound on the second area; (c) removing the tapes; (d) cutting the protective compound according to the identification marks; and (e) breaking the ceramic substrate into individual circuit unit pieces along the grooves.

Abstract translation: 陶瓷基板（100）包括顶表面，多个识别标记（104），保护化合物（110），底表面和多个凹槽（106）。 顶表面包括第一区域和第二区域。 第一区域被限定在顶表面的一个或多个边缘部分。 第二个区域定义在第一个区域内。 识别标记布置在第一区域上。 保护性化合物覆盖在第二区域。 凹槽限定在底面，并与识别标记对应。 破坏陶瓷基板的相关方法包括：（a）在第一区域上粘贴一个或多个带; （b）在第二区覆盖保护化合物; （c）清除胶带; （d）根据识别标记切割保护性化合物; 和（e）沿着凹槽将陶瓷基板分解成单独的电路单元件。

公开(公告)号：US07575954B2

公开(公告)日：2009-08-18

申请号：US11323269

申请日：2005-12-30

Applicant: Xiao-Hua Kong

Inventor： Xiao-Hua Kong

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H01L21/67132 ,  H01L21/786 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09918 ,  H05K2203/1383 ,  H05K2203/302 ,  Y10T29/49135

Abstract: A ceramic substrate (100) includes a top surface, a plurality of identification marks (104), a protective compound (110), a bottom surface, and a plurality of grooves (106). The top surface includes a first area and a second area. The first area is defined at one or more edges portions of the top surface. The second area is defined inside the first area. The identification marks are arranged on the first area. The protective compound is covered on the second area. The grooves are defined at the bottom surface, and corresponding to the identification marks. A related method for breaking a ceramic substrate includes: (a) pasting one or more tapes on the first area; (b) covering protective compound on the second area; (c) removing the tapes; (d) cutting the protective compound according to the identification marks; and (e) breaking the ceramic substrate into individual circuit unit pieces along the grooves.

Abstract translation: 陶瓷基板（100）包括顶表面，多个识别标记（104），保护化合物（110），底表面和多个凹槽（106）。 顶表面包括第一区域和第二区域。 第一区域被限定在顶表面的一个或多个边缘部分。 第二个区域定义在第一个区域内。 识别标记布置在第一区域上。 保护性化合物覆盖在第二区域。 凹槽限定在底面，并与识别标记对应。 破坏陶瓷基板的相关方法包括：（a）在第一区域上粘贴一个或多个带; （b）在第二区覆盖保护化合物; （c）清除胶带; （d）根据识别标记切割保护性化合物; 和（e）沿着凹槽将陶瓷基板分解成单独的电路单元件。

公开(公告)号：US20060221591A1

公开(公告)日：2006-10-05

申请号：US11322870

申请日：2005-12-30

Applicant: Xiao-Hua Kong

Inventor： Xiao-Hua Kong

IPC: H05K9/00

CPC classification number: H05K9/0026 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/16151 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0969 ,  H05K2201/10371 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An exemplary Electromagnetic Interference (EMI) shielding package (1) includes a substrate (10), a metal cap (15), and a potting compound (18). The substrate has a plurality of electronic components (11a, 11b, 12) fixed thereon. The metal cap includes a horizontal base panel (152) and a plurality of peripheral walls (151) vertical to the base panel. A related method for making the EMI shielding package includes: providing a substrate with a plurality of electronic components fixed thereon; providing a metal cap including a horizontal base panel and a plurality of peripheral walls vertical to the base panel; attaching the walls to the substrate, thereby covering selected one or more of the electronic components that need to be shielded with the metal cap; sealing the electronic components and the metal cap with a potting compound; and curing the potting compound to form an encapsulation.

Abstract translation: 示例性电磁干扰（EMI）屏蔽封装（1）包括衬底（10），金属帽（15）和灌封化合物（18）。 基板具有固定在其上的多个电子部件（11a，11b，12）。 金属盖包括垂直于基板的水平基板（152）和多个周壁（151）。 制造EMI屏蔽封装的相关方法包括：提供固定有多个电子部件的基板; 提供包括水平基板和垂直于所述基板的多个周壁的金属盖; 将壁附接到基板，从而覆盖需要被金属盖屏蔽的所选择的一个或多个电子部件; 用灌封胶密封电子元件和金属盖; 并固化灌封化合物以形成封装。