公开(公告)号：US20160360619A1

公开(公告)日：2016-12-08

申请号：US14954273

申请日：2015-11-30

Applicant: YAGEO CORPORATION

Inventor： Sheng-Li HSIAO ,  Yung-Han Liu ,  Shih-Hsin CHANG ,  Ping-Chuen KUO ,  Shu-Fang CHEN ,  Ching-Chang LIN

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/18 ,  H05K1/113 ,  H05K1/141 ,  H05K1/167 ,  H05K2201/049 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A passive device includes a substrate that has opposite first and second surfaces, an electrical connecting unit, a first passive unit, and a second passive unit. The electrical connecting unit includes a first pad formed on the first surface and a second pad formed on the second surface and is electrically connected to the first pad. The first passive unit is formed on the first surface and electrically connected to the first pad. The second passive unit is formed on the second surface and includes two separated electrode layers electrically insulated from the electrical connecting unit, and an insulator layer interconnecting the electrode layers.

Abstract translation: 无源器件包括具有相对的第一和第二表面的基板，电连接单元，第一无源单元和第二无源单元。 电连接单元包括形成在第一表面上的第一焊盘和形成在第二表面上并与第一焊盘电连接的第二焊盘。 第一无源单元形成在第一表面上并电连接到第一焊盘。 第二无源单元形成在第二表面上，并且包括与电连接单元电绝缘的两个分开的电极层和互连电极层的绝缘体层。

公开(公告)号：US20220223325A1

公开(公告)日：2022-07-14

申请号：US17234820

申请日：2021-04-20

Applicant: YAGEO CORPORATION

Inventor： Shen-Li HSIAO ,  Ching-Chang LIN ,  I-Liang SHEN

IPC: H01C17/00 ,  H01C17/28 ,  H01C17/065

Abstract: A method for manufacturing a resistor is described. First and second division lines are formed in a first surface of a substrate to define device areas. First and second electrodes are formed on the first surface and respectively on the device areas. Third electrodes, fourth electrodes, and resistive layers are formed on a second surface of the substrate and respectively on the device areas. The substrate is diced from the second surface by a cutting tool to form bar structures to expose opposite first and second side surfaces of the device areas. First and second terminal electrodes are formed to respectively cover the first and second side surfaces. The bar structures are diced from the second surface by the cutting tool to separate the device areas. The cutting tool is aligned with the first and second division lines respectively while dicing the substrate and the bar structures.