公开(公告)号：US09336931B2

公开(公告)日：2016-05-10

申请号：US14298286

申请日：2014-06-06

Applicant: YAGEO CORPORATION

Inventor： Dong-Mou Tsai ,  Tsai-Hu Chen ,  Sheng-Li Hsiao ,  Yung-Han Liu ,  Jen-Fu Ho

IPC: H01C1/012 ,  H01C1/142

CPC classification number: H01C1/142 ,  H01C1/012 ,  H01C1/028 ,  H01C7/003 ,  H01C17/006

Abstract: The disclosure provides a chip resistor including: a substrate, two first electrodes, two second electrodes, a resistive layer, at least one protection layer and at least one coating layer. The protection layer covers part of the two first electrodes, and includes at least two overlay sides and at least one overlay plane. The coating layer covers the at least two overlay sides, the at least one overlay plane, and part of the two first electrodes and the two second electrodes. The chip resistor uses the two overlay sides and the overplay plane to extend a distance between the two first electrodes and the outside. Therefore, it is difficult for the airborne sulfur, sulfides and sulfur-containing compounds to enter and react with the two first electrodes. Thus, the chip resistor can resist corrosion of harmful substances such as sulfur, sulfides and sulfur-containing compounds or halogens on the electrodes.

Abstract translation: 本公开提供一种片式电阻器，包括：衬底，两个第一电极，两个第二电极，电阻层，至少一个保护层和至少一个涂层。 保护层覆盖两个第一电极的一部分，并且包括至少两个覆盖面和至少一个覆盖平面。 涂层覆盖至少两个覆盖面，至少一个覆盖平面以及两个第一电极和两个第二电极的一部分。 芯片电阻器使用两个覆盖层和超平面来延伸两个第一电极和外部之间的距离。 因此，空气中的硫，硫化物和含硫化合物难以进入并与两个第一电极反应。 因此，芯片电阻器可以抵抗有害物质如硫，硫化物和含硫化合物或卤素在电极上的腐蚀。

公开(公告)号：US20160360619A1

公开(公告)日：2016-12-08

申请号：US14954273

申请日：2015-11-30

Applicant: YAGEO CORPORATION

Inventor： Sheng-Li HSIAO ,  Yung-Han Liu ,  Shih-Hsin CHANG ,  Ping-Chuen KUO ,  Shu-Fang CHEN ,  Ching-Chang LIN

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/18 ,  H05K1/113 ,  H05K1/141 ,  H05K1/167 ,  H05K2201/049 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A passive device includes a substrate that has opposite first and second surfaces, an electrical connecting unit, a first passive unit, and a second passive unit. The electrical connecting unit includes a first pad formed on the first surface and a second pad formed on the second surface and is electrically connected to the first pad. The first passive unit is formed on the first surface and electrically connected to the first pad. The second passive unit is formed on the second surface and includes two separated electrode layers electrically insulated from the electrical connecting unit, and an insulator layer interconnecting the electrode layers.

Abstract translation: 无源器件包括具有相对的第一和第二表面的基板，电连接单元，第一无源单元和第二无源单元。 电连接单元包括形成在第一表面上的第一焊盘和形成在第二表面上并与第一焊盘电连接的第二焊盘。 第一无源单元形成在第一表面上并电连接到第一焊盘。 第二无源单元形成在第二表面上，并且包括与电连接单元电绝缘的两个分开的电极层和互连电极层的绝缘体层。