公开(公告)号：US20100165094A1

公开(公告)日：2010-07-01

申请号：US12376950

申请日：2007-08-10

Applicant: Yoshihisa Kakuda ,  Tsutomu Nakashima

Inventor： Yoshihisa Kakuda ,  Tsutomu Nakashima

IPC: H04N7/18

CPC classification number: G01N21/95684 ,  G01B11/24 ,  H05K1/0269 ,  H05K3/3484

Abstract: An inspecting apparatus and an inspecting method capable of detecting a state inside the cream solder are provided.An illumination device (5) irradiates infrared light at predetermined intensity to a board on which cream solder is applied. An image taking device (6) takes an image of the board to which the infrared light is irradiated. A main control portion (95) in a control device (9) is capable of detecting a sectional shape of the cream solder according to an intensity distribution of infrared light reflected on the board from image data of the image captured by the image taking device (6). Also, because reflected light from the cream solder surface can be eliminated by an elimination portion (95c), the sectional shape of the solder can be detected more exactly.

Abstract translation: 提供了能够检测奶油焊料内部的状态的检查装置和检查方法。 照明装置（5）将预定强度的红外光照射到涂敷有膏状焊膏的基板上。 摄像装置（6）拍摄红外光照射的基板的图像。 控制装置（9）中的主控制部（95）能够根据由摄像装置拍摄的图像的图像数据，根据由板上反射的红外光的强度分布来检测奶油焊料的截面形状（ 6）。 此外，由于可以通过消除部分（95c）消除来自奶油焊料表面的反射光，因此可以更准确地检测焊料的截面形状。

公开(公告)号：US20100010665A1

公开(公告)日：2010-01-14

申请号：US12439554

申请日：2007-08-28

Applicant: Yoshihisa Kakuda

Inventor： Yoshihisa Kakuda

IPC: G06F7/00

CPC classification number: H05K1/0269 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/09936

Abstract: A board inspection device 1 comprises: an inspection unit 50 for inspecting a board P; a board-supplying unit 24 that enables a board P to be manually supplied to the inspection unit 50; and a liquid crystal monitor 4 for displaying prescribed information including the results of an inspection of the board P, wherein the board inspection device 1 is further provided with: a camera 52 for recognizing identification information assigned to the board P; and a control unit 60 that confirms inspection history of the board P based on the identification information acquired via the camera 52 and controls, when it is confirmed that the board P has already been inspected, the liquid crystal monitor 4 to display information to the effect that the board P has already been inspected and prohibits execution of an inspection operation on the board P by the inspection unit 50.

Abstract translation: 板检查装置1包括：用于检查板P的检查单元50; 板供给单元24，其能够将板P手动供给到检查单元50; 以及液晶监视器4，用于显示包括板P的检查结果的规定信息，其中板检测装置1还设置有：用于识别分配给板P的识别信息的照相机52; 以及控制单元60，其基于经由照相机52获取的识别信息来确认纸板P的检查历史，并且当确认已经检查了纸板P时，控制液晶监视器4以显示信息 板P已经被检查，并且禁止由检查单元50在板P上执行检查操作。

公开(公告)号：US20100027873A1

公开(公告)日：2010-02-04

申请号：US12439594

申请日：2007-08-28

Applicant: Yoshihisa Kakuda

Inventor： Yoshihisa Kakuda

IPC: G06K9/00

CPC classification number: G01N21/95684 ,  G01N21/95607 ,  G01N2021/95615 ,  G01N2021/95638 ,  H05K1/0269 ,  H05K3/3484

Abstract: Problem to be Solved To efficiently perform a board appearance inspection with a simple structure.Solution A control unit 60 performs processing for comparing a picked-up image of a board P picked up by a camera 52 with standard image data stored in a memory unit 61 and judging whether the board is good or poor. When the board P is judged to be poor, an image of the board P is displayed on a liquid crystal monitor 4 in order to have an operator visually judge the board P. When the board P is judged to be good by the visual judgment, the picked-up image of the board P that is judged to be good is additionally stored in the memory unit 61 as the standard image data.

Abstract translation: 要解决的问题以简单的结构有效地执行电路板外观检查。 解决方案控制单元60执行用于将由照相机52拾取的板P的拾取图像与存储在存储单元61中的标准图像数据进行比较的处理，并判断板是好还是差。 当判断板P差时，将液晶显示器4上的图像显示在液晶监视器4上，以便操作者可以目视地判断板P.当通过目视判断判断板P是好的时， 被判断为良好的板P的拾取图像作为标准图像数据另外存储在存储器单元61中。

公开(公告)号：US20100021050A1

公开(公告)日：2010-01-28

申请号：US12442299

申请日：2007-09-21

Applicant: Yoshihisa Kakuda ,  Tsutomu Nakashima

Inventor： Yoshihisa Kakuda ,  Tsutomu Nakashima

IPC: G06K9/00

CPC classification number: G01B11/24 ,  B23K1/0016 ,  B23K31/12 ,  B23K2101/40 ,  B23K2101/42 ,  G01N21/95684 ,  G01N2021/95669 ,  H05K1/0269 ,  H05K3/1216 ,  H05K3/3484 ,  H05K2203/163

Abstract: The shape of a cream solder is accurately detected, irrespective of a cream solder composition. An illumination setting section (95b) sets the intensity of infrared light radiated by an illuminating device (5), in accordance with the cream solder composition. An photographing device (6) irradiates a board applied with the cream solder with the infrared light having the light intensity set by the illuminating device (5). The photographing device (6) images the board irradiated with the infrared light by the illuminating device (5). As a result, an image including an image of light reflected from a surface of the board can be acquired.

Abstract translation: 准确地检测出膏状焊料的形状，而与奶油焊料组成无关。 照明设定部（95b）根据膏状焊膏成分设定由照明装置（5）照射的红外线的强度。 拍摄装置（6）利用由照明装置（5）设定的光强度的红外光照射涂布有膏状焊料的板。 拍摄装置（6）通过照明装置（5）对由红外光照射的板进行成像。 结果，可以获得包括从板的表面反射的光的图像的图像。