Abstract:
At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. According to a further aspect, a solid-state imaging apparatus for photoelectrically converting, with an imaging device, an image formed by introducing imaging light into the inside of the apparatus is provided with a package having a dark space in itself and accommodating the imaging device in the dark space, and a pinhole for introducing imaging light into the dark space and forming an image of an imaging object on the imaging face of the imaging device.
Abstract:
A resolver use angle detection IC subjected to a phase lock operation so as to follow not an angle θ(t) for detection, but a phase angle ωot±θ(t) having an offset of a frequency ωot in the phase lock units. For this reason, when the excitation frequency ωot is set sufficiently high with respect to the frequency of the angle θ(t), the phase angle ωot±θ to be followed in the phase lock units will not become zero. For this reason, an angle having a high precision can be found in real time regardless of the configuration not including the conventional apparatus in which the configuration is complex and the power consumption is large like a bipolar VCO and an up/down type counter.
Abstract:
A disk brake wherein the engagement portions of a return spring are prevented from coming out of respective retaining holes formed in the backing plates of friction pads, and at the same time the spring function portion of the return spring is prevented from interfering with the disk. After the caliper has been mounted on the carrier, the return spring is supported at three portions at each end thereof. The spring function portion is contacted by the protuberance, while the proximal end of each engagement portion is contacted by the entrance portion of the associated retaining hole. Further, the distal end of the engagement portion is contacted by the innermost portion of the retaining hole. In addition, the spring function portion of the return spring is bent radially outward of the disk along a recess formed on the inner side of the caliper.
Abstract:
At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. According to a further aspect, a solid-state imaging apparatus for photoelectrically converting, with an imaging device, an image formed by introducing imaging light into the inside of the apparatus is provided with a package having a dark space in itself and accommodating the imaging device in the dark space, and a pinhole for introducing imaging light into the dark space and forming an image of an imaging object on the imaging face of the imaging device.
Abstract:
At least a solid-state imaging device and one or a plurality of bare ICs that are disposed on the back face or on the back face side of the solid-state imaging apparatus and serve as peripheral circuits are provided. The bare ICs are sealed by a resin. A circuit board may be interposed between the solid-state imaging device and the bare ICs, or the solid-state imaging device and the ICs are directly bonded together. According to another aspect, IC chips and other parts as peripheral circuits of a solid-state imaging device are disposed on the inner surface, mainly the ceiling surface, of a light-shielding case. According to a further aspect, a solid-state imaging apparatus for photoelectrically converting, with an imaging device, an image formed by introducing imaging light into the inside of the apparatus is provided with a package having a dark space in itself and accommodating the imaging device in the dark space, and a pinhole for introducing imaging light into the dark space and forming an image of an imaging object on the imaging face of the imaging device.
Abstract:
A modulation circuit for outputting a pulse signal modulated in accordance with the value of input data by a predetermined period, comprising a clock generation circuit for generating and outputting a first clock pulse changing in frequency by the predetermined period, a clock counting circuit for receiving the first clock pulse, counting the first clock pulse from a predetermined initial value in an initial stage of the predetermined period, and outputting a clock count and a pulse signal output circuit for comparing magnitudes of the clock count and the value of the input data and inverting a level of the pulse signal in the vicinity of a time when the magnitudes of the clock count and the value of the input data invert.
Abstract:
A temperature-compensated crystal oscillator including an oscillation circuit which includes an oscillator, a temperature detector, a voltage variable capacitance element coupled to an oscillation loop of the oscillation circuit, and a temperature compensation circuit. The temperature compensation circuit is configured to apply a compensation voltage to the voltage variable capacitance element to compensate a temperature change in response to temperature data detected by the temperature detector. The temperature compensation circuit has a plurality of correction point data. The respective correction point data is set in advance for each divided temperature zone, selects a first correction point data in a lower temperature zone and a second correction point data in a higher temperature zone, as compared with the detected temperature data, performs an interpolation between the first and second correction point data by a weighted averaged first-order interpolation, and generates the compensation voltage.
Abstract:
A resolver use angle detection IC subjected to a phase lock operation so as to follow not an angle θ(t) for detection, but a phase angle ωot±θ(t) having an offset of a frequency ωot in the phase lock units. For this reason, when the excitation frequency ωot is set sufficiently high with respect to the frequency of the angle θ(t), the phase angle ωot±θ to be followed in the phase lock units will not become zero. For this reason, an angle having a high precision can be found in real time regardless of the configuration not including the conventional apparatus in which the configuration is complex and the power consumption is large like a bipolar VCO and an up/down type counter.
Abstract:
A modulation circuit capable of high resolution pulse width modulation while keeping down the bit length and an image display provided with the modulation circuit. By the A/D converter 4, the video signal Sv converted into a binary code having a preset bit length is divided into a plurality of binary codes by the controller 3 from the most significant bit to the least significant bit. Corresponding to the thus obtained plurality of divided binary codes, serial data is generated for producing a pulse current of a pulse width and current value according to the value of the binary code and is output to pulse width modulation circuits 1 cascade connected to the controller 3. The pulse width modulation circuits supply LEDs 3 of the pixels pulse currents of pulse widths and current values corresponding to the serial data.