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公开(公告)号:US20180007800A1
公开(公告)日:2018-01-04
申请号:US15514493
申请日:2015-09-30
Applicant: ZEON CORPORATION
Inventor: Natsuko SHINDOU , Shigeru FUJITA
IPC: H05K3/40 , H05K3/22 , H05K3/00 , C25D5/02 , B32B37/06 , C23C14/20 , C23C14/34 , B32B38/00 , B32B38/10 , H05K3/46 , C25D3/38 , B32B38/04
CPC classification number: H05K3/4038 , B32B15/08 , B32B37/06 , B32B37/26 , B32B38/0008 , B32B38/04 , B32B38/10 , B32B2037/268 , B32B2038/0076 , B32B2038/042 , B32B2038/168 , B32B2309/02 , B32B2309/04 , B32B2309/105 , B32B2309/12 , B32B2311/12 , B32B2457/08 , C23C14/205 , C23C14/34 , C23C18/1651 , C25D3/38 , C25D5/022 , C25D7/00 , H05K3/0032 , H05K3/005 , H05K3/22 , H05K3/4076 , H05K3/42 , H05K3/4644 , H05K2201/0347
Abstract: To provide a manufacturing method of a laminate body, including: a step of forming onto a supporting body a curable resin composition layer formed from a thermosetting resin composition to obtain a curable resin composition layer with a supporting body; a step of laminating the curable resin composition onto a substrate on a curable resin composition layer forming surface side to obtain a pre-cured composite with a supporting body formed from a substrate and a curable resin composition layer with a supporting body; a step of performing a first heating of the pre-cured composite and thermally curing the curable resin composition layer to obtain a cured composite with a supporting body formed from a substrate and a cured resin layer with a supporting body; a step of performing hole punching from the supporting body side of the cured composite with a supporting body to form a via hole in the cured resin layer; step of removing resin residue in the via hole of the cured composite with a supporting body; a step of peeling the supporting body from the cured composite with a supporting body to obtain a cured composite formed from a substrate and a cured resin layer, and a step of forming a dry plated conductor layer by dry plating on an inner wall surface of the via hole of the cured composite and on the cured resin layer.